Inventor
KASHIBA YOSHIHIRO
JP23 patents
⚠️ This page may combine multiple inventors who share the name “KASHIBA YOSHIHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
19 patentsUS6633176B2Oct 14, 2003
Semiconductor device test probe having improved tip portion and manufacturing method thereof
MITSUBISHI ELECTRIC CORP47 citations95
US6794890B1Sep 21, 2004
Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested
MITSUBISHI ELECTRIC CORP48 citations94
US7274195B2Sep 25, 2007
Semiconductor device test probe
MITSUBISHI ELECTRIC CORP26 citations92
US6741086B2May 25, 2004
Member for removing foreign matter adhering to probe tip and method of manufacturing the probe tip, method of cleaning foreign matter adhering to probe tip, probe, and probing apparatus
MITSUBISHI ELECTRIC CORP50 citations92
US5251803AOct 12, 1993
Ceramic-metal composite substrate and method for producing the same
MITSUBISHI ELECTRIC CORP27 citations92
US5153077AOct 6, 1992
Ceramic-metal composite substrate
MITSUBISHI ELECTRIC CORP31 citations92
US6979843B2Dec 27, 2005
Power semiconductor device
MITSUBISHI ELECTRIC CORP39 citations91
US6888344B2May 3, 2005
Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter
MITSUBISHI ELECTRIC CORP24 citations91
US6867484B2Mar 15, 2005
Semiconductor device
MITSUBISHI ELECTRIC CORP39 citations91
US5609287AMar 11, 1997
Solder material, junctioning method, junction material, and semiconductor device
MITSUBISHI ELECTRIC CORP29 citations90
US6989681B2Jan 24, 2006
Socket for testing a semiconductor device and a connecting sheet used for the same
MITSUBISHI ELECTRIC CORP15 citations84
US6882069B1Apr 19, 2005
Vehicle AC generator with rectifier diode package disposed between cooling plates
MITSUBISHI ELECTRIC CORP16 citations84
US7276923B2Oct 2, 2007
Semiconductor device test probe
MITSUBISHI ELECTRIC CORP12 citations83
US5637917AJun 10, 1997
Lead frame assembly for a semiconductor device
MITSUBISHI ELECTRIC CORP8 citations74
US6885204B2Apr 26, 2005
Probe card, and testing apparatus having the same
MITSUBISHI ELECTRIC CORP7 citations73
US6667626B2Dec 23, 2003
Probe card, and testing apparatus having the same
MITSUBISHI ELECTRIC CORP6 citations73
US6628127B2Sep 30, 2003
Probe card for testing semiconductor integrated circuit and method of manufacturing the same
MITSUBISHI ELECTRIC CORP9 citations73
US9236316B2Jan 12, 2016
Semiconductor device and method for manufacturing the same
MITSUBISHI ELECTRIC CORP5 citations72
US6118172ASep 12, 2000
High-frequency circuit device and manufacturing method thereof
MITSUBISHI ELECTRIC CORP1 citations52