Inventor
LAINE ERIC H
US5 patents
⚠️ This page may combine multiple inventors who share the name “LAINE ERIC H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
4 patentsUS5616958AApr 1, 1997
Electronic package
IBM122 citations97
US5952716ASep 14, 1999
Pin attach structure for an electronic package
IBM33 citations90
US6438830B1Aug 27, 2002
Process of producing plastic pin grid array
IBM14 citations82
US7932169B2Apr 26, 2011
Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers
IBM1 citations51