P

Inventor

FAIRBAIRN KEVIN

US55 patents
⚠️ This page may combine multiple inventors who share the name “FAIRBAIRN KEVIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLIED MATERIALS INC

38 patents
US6220201B1Apr 24, 2001

High density plasma CVD reactor with combined inductive and capacitive coupling

APPLIED MATERIALS INC202 citations99
US6187072B1Feb 13, 2001

Method and apparatus for reducing perfluorocompound gases from substrate processing equipment emissions

APPLIED MATERIALS INC154 citations99
US6176667B1Jan 23, 2001

Multideck wafer processing system

APPLIED MATERIALS INC333 citations99
US6039834AMar 21, 2000

Apparatus and methods for upgraded substrate processing system with microwave plasma source

APPLIED MATERIALS INC242 citations99
US5865896AFeb 2, 1999

High density plasma CVD reactor with combined inductive and capacitive coupling

APPLIED MATERIALS INC331 citations99
US5844195ADec 1, 1998

Remote plasma source

APPLIED MATERIALS INC388 citations99
US5614055AMar 25, 1997

High density plasma CVD and etching reactor

APPLIED MATERIALS INC536 citations99
US6635115B1Oct 21, 2003

Tandem process chamber

APPLIED MATERIALS INC500 citations98
US6573030B1Jun 3, 2003

Method for depositing an amorphous carbon layer

APPLIED MATERIALS INC1,317 citations98
US6358573B1Mar 19, 2002

Mixed frequency CVD process

APPLIED MATERIALS INC130 citations98
US6152070ANov 28, 2000

Tandem process chamber

APPLIED MATERIALS INC455 citations98
US6045618AApr 4, 2000

Microwave apparatus for in-situ vacuum line cleaning for substrate processing equipment

APPLIED MATERIALS INC130 citations98
US5911834AJun 15, 1999

Gas delivery system

APPLIED MATERIALS INC133 citations98
US5855681AJan 5, 1999

Ultra high throughput wafer vacuum processing system

APPLIED MATERIALS INC1,143 citations98
US5558717ASep 24, 1996

CVD Processing chamber

APPLIED MATERIALS INC1,163 citations98
US6841341B2Jan 11, 2005

Method of depositing an amorphous carbon layer

APPLIED MATERIALS INC78 citations97
US6098568AAug 8, 2000

Mixed frequency CVD apparatus

APPLIED MATERIALS INC106 citations97
US6082950AJul 4, 2000

Front end wafer staging with wafer cassette turntables and on-the-fly wafer center finding

APPLIED MATERIALS INC154 citations97
US5902088AMay 11, 1999

Single loadlock chamber with wafer cooling function

APPLIED MATERIALS INC115 citations97
US5838121ANov 17, 1998

Dual blade robot

APPLIED MATERIALS INC112 citations97
US5556147ASep 17, 1996

Wafer tray and ceramic blade for semiconductor processing apparatus

APPLIED MATERIALS INC112 citations97
US7223526B2May 29, 2007

Method of depositing an amorphous carbon layer

APPLIED MATERIALS INC50 citations96
US6517913B1Feb 11, 2003

Method and apparatus for reducing perfluorocompound gases from substrate processing equipment emissions

APPLIED MATERIALS INC65 citations96
US6361707B1Mar 26, 2002

Apparatus and methods for upgraded substrate processing system with microwave plasma source

APPLIED MATERIALS INC39 citations96
US6230652B1May 15, 2001

Apparatus and methods for upgraded substrate processing system with microwave plasma source

APPLIED MATERIALS INC43 citations96
US5976308ANov 2, 1999

High density plasma CVD and etching reactor

APPLIED MATERIALS INC51 citations96
US5909994AJun 8, 1999

Vertical dual loadlock chamber

APPLIED MATERIALS INC130 citations96
US5853607ADec 29, 1998

CVD processing chamber

APPLIED MATERIALS INC91 citations96
US6486444B1Nov 26, 2002

Load-lock with external staging area

APPLIED MATERIALS INC101 citations95
US5636964AJun 10, 1997

Wafer tray and ceramic blade for semiconductor processing apparatus

APPLIED MATERIALS INC75 citations95
US5570994ANov 5, 1996

Wafer tray and ceramic blade for semiconductor processing apparatus

APPLIED MATERIALS INC60 citations95
US6364995B1Apr 2, 2002

Dome-shaped inductive coupling wall having a plurality of radii for an inductively coupled plasma reactor

APPLIED MATERIALS INC14 citations93
US7335462B2Feb 26, 2008

Method of depositing an amorphous carbon layer

APPLIED MATERIALS INC24 citations92
US6354241B1Mar 12, 2002

Heated electrostatic particle trap for in-situ vacuum line cleaning of a substrated processing

APPLIED MATERIALS INC48 citations92
US6077157AJun 20, 2000

Process chamber exhaust system

APPLIED MATERIALS INC42 citations92
US7655092B2Feb 2, 2010

Tandem process chamber

APPLIED MATERIALS INC27 citations91
US5697748ADec 16, 1997

Wafer tray and ceramic blade for semiconductor processing apparatus

APPLIED MATERIALS INC30 citations91
US6163007ADec 19, 2000

Microwave plasma generating apparatus with improved heat protection of sealing O-rings

APPLIED MATERIALS INC14 citations74

ADVANCED ENERGY IND INC

12 patents

Showing the top 50 of 55 patents by PatentIndex Score.