Inventor
SONO MICHIO
JP28 patents
Patents
28 patentsUS5920117AJul 6, 1999
Semiconductor device and method of forming the device
FUJITSU LTD135 citations98
US5801439ASep 1, 1998
Semiconductor device and semiconductor device unit for a stack arrangement
FUJITSU LTD168 citations98
US5643831AJul 1, 1997
Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device
FUJITSU LTD231 citations98
US5451815ASep 19, 1995
Semiconductor device with surface mount package adapted for vertical mounting
FUJITSU LTD134 citations98
US6025258AFeb 15, 2000
Method for fabricating solder bumps by forming solder balls with a solder ball forming member
FUJITSU LTD94 citations97
US5804468ASep 8, 1998
Process for manufacturing a packaged semiconductor having a divided leadframe stage
FUJITSU LTD65 citations96
US5521432AMay 28, 1996
Semiconductor device having improved leads comprising palladium plated nickel
FUJITSU LTD84 citations96
US5497032AMar 5, 1996
Semiconductor device and lead frame therefore
FUJITSU LTD65 citations96
US4788583ANov 29, 1988
Semiconductor device and method of producing semiconductor device
FUJITSU LTD72 citations96
US4661837AApr 28, 1987
Resin-sealed radiation shield for a semiconductor device
FUJITSU LTD63 citations96
US5760471AJun 2, 1998
Semiconductor device having an inner lead extending over a central portion of a semiconductor device sealed in a plastic package and an outer lead exposed to the outside of a side face of the plastic package
FUJITSU LTD71 citations95
US5424251AJun 13, 1995
Method of producing semiconductor device having radiation part made of resin containing insulator powders
FUJITSU LTD41 citations93
US5296740AMar 22, 1994
Method and apparatus for a semiconductor device having a radiation part
FUJITSU LTD20 citations93
US6528346B2Mar 4, 2003
Bump-forming method using two plates and electronic device
FUJITSU LTD24 citations92
US6022759AFeb 8, 2000
Method for producing a semiconductor device, base member for semiconductor device and semiconductor device unit
FUJITSU LTD31 citations92
US5786985AJul 28, 1998
Semiconductor device and semiconductor device unit
FUJITSU LTD47 citations92
US5747874AMay 5, 1998
Semiconductor device, base member for semiconductor device and semiconductor device unit
FUJITSU LTD37 citations92
US5703398ADec 30, 1997
Semiconductor integrated circuit device and method of producing the semiconductor integrated circuit device
FUJITSU LTD51 citations92
US5684675ANov 4, 1997
Semiconductor device unit having holder
FUJITSU LTD30 citations92
US5574310ANov 12, 1996
Semiconductor package for surface mounting with reinforcing members on support legs
FUJITSU LTD21 citations92
US5444025AAug 22, 1995
Process for encapsulating a semiconductor package having a heat sink using a jig
FUJITSU LTD39 citations92
US5305179AApr 19, 1994
Surface-mounting type semiconductor package having an improved efficiency for heat dissipation
FUJITSU LTD39 citations92
US5861669AJan 19, 1999
Semiconductor package for surface mounting
FUJITSU LTD10 citations74
US5659200AAug 19, 1997
Semiconductor device having radiator structure
FUJITSU LTD11 citations73
US5309016AMay 3, 1994
Semiconductor integrated circuit device having terminal members provided between semiconductor element and leads
FUJITSU LTD14 citations73
US5361970ANov 8, 1994
Method of producing a semiconductor integrated circuit device having terminal members provided between semiconductor element and leads
FUJITSU LTD4 citations62
US5343615ASep 6, 1994
Semiconductor device and a process for making same having improved leads
FUJITSU LTD2 citations60
US5831332ANov 3, 1998
Semiconductor package for surface mounting
FUJITSU LTD1 citations52