Inventor
TSUJI KAZUTO
JP51 patents
Patents
50 patentsUS6376921B1Apr 23, 2002
Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame
FUJITSU LTD120 citations99
US6255740B1Jul 3, 2001
Semiconductor device having a lead portion with outer connecting terminals
FUJITSU LTD122 citations99
US6072239AJun 6, 2000
Device having resin package with projections
FUJITSU LTD241 citations99
US5656550AAug 12, 1997
Method of producing a semicondutor device having a lead portion with outer connecting terminal
FUJITSU LTD366 citations99
US5625222AApr 29, 1997
Semiconductor device in a resin package housed in a frame having high thermal conductivity
FUJITSU LTD1,025 citations99
US6573121B2Jun 3, 2003
Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame
FUJITSU LTD126 citations98
US6025650AFeb 15, 2000
Semiconductor device including a frame terminal
FUJITSU LTD220 citations98
US5451815ASep 19, 1995
Semiconductor device with surface mount package adapted for vertical mounting
FUJITSU LTD134 citations98
US6159770ADec 12, 2000
Method and apparatus for fabricating semiconductor device
FUJITSU LTD212 citations96
US5930603AJul 27, 1999
Method for producing a semiconductor device
FUJITSU LTD77 citations96
US5842628ADec 1, 1998
Wire bonding method, semiconductor device, capillary for wire bonding and ball bump forming method
FUJITSU LTD56 citations96
US5804468ASep 8, 1998
Process for manufacturing a packaged semiconductor having a divided leadframe stage
FUJITSU LTD65 citations96
US5569625AOct 29, 1996
Process for manufacturing a plural stacked leadframe semiconductor device
FUJITSU LTD47 citations96
US5521432AMay 28, 1996
Semiconductor device having improved leads comprising palladium plated nickel
FUJITSU LTD84 citations96
US5497032AMar 5, 1996
Semiconductor device and lead frame therefore
FUJITSU LTD65 citations96
US5293072AMar 8, 1994
Semiconductor device having spherical terminals attached to the lead frame embedded within the package body
FUJITSU LTD97 citations96
US6495773B1Dec 17, 2002
Wire bonded device with ball-shaped bonds
FUJITSU LTD38 citations93
US5904506AMay 18, 1999
Semiconductor device suitable for testing
FUJITSU LTD21 citations93
US5767527AJun 16, 1998
Semiconductor device suitable for testing
FUJITSU LTD31 citations93
US5440170AAug 8, 1995
Semiconductor device having a die pad with rounded edges and its manufacturing method
FUJITSU LTD20 citations93
US7193320B2Mar 20, 2007
Semiconductor device having a heat spreader exposed from a seal resin
FUJITSU LTD24 citations92
US6856017B2Feb 15, 2005
Device having resin package and method of producing the same
FUJITSU LTD13 citations92
US6798031B2Sep 28, 2004
Semiconductor device and method for making the same
FUJITSU LTD39 citations92
US6696754B2Feb 24, 2004
Semiconductor module including a plurality of semiconductor devices detachably
FUJITSU LTD20 citations92
US6472744B2Oct 29, 2002
Semiconductor module including a plurality of semiconductor devices detachably
FUJITSU LTD31 citations92
US6191494B1Feb 20, 2001
Semiconductor device and method of producing the same
FUJITSU LTD99 citations92
US6069408AMay 30, 2000
Semiconductor device and method of manufacturing semiconductor device
FUJITSU LTD32 citations92
US5891758AApr 6, 1999
Semiconductor device and method for manufacturing semiconductor device
FUJITSU LTD23 citations92
US5786985AJul 28, 1998
Semiconductor device and semiconductor device unit
FUJITSU LTD47 citations92
US5750421AMay 12, 1998
Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor device
FUJITSU LTD27 citations92
US5703398ADec 30, 1997
Semiconductor integrated circuit device and method of producing the semiconductor integrated circuit device
FUJITSU LTD51 citations92
US5684675ANov 4, 1997
Semiconductor device unit having holder
FUJITSU LTD30 citations92
US5666064ASep 9, 1997
Semiconductor device, carrier for carrying semiconductor device, and method of testing and producing semiconductor device
FUJITSU LTD25 citations92
US5574310ANov 12, 1996
Semiconductor package for surface mounting with reinforcing members on support legs
FUJITSU LTD21 citations92
US5475259ADec 12, 1995
Semiconductor device and carrier for carrying semiconductor device
FUJITSU LTD29 citations92
US5403776AApr 4, 1995
Process of using a jig to align and mount terminal conductors to a semiconductor plastic package
FUJITSU LTD27 citations92
US5654243AAug 5, 1997
Process for fabricating a semiconductor device in a resin package housed in a frame having high conductivity
FUJITSU LTD16 citations82
US5637923AJun 10, 1997
Semiconductor device, carrier for carrying semiconductor device
FUJITSU LTD11 citations82
US5399804AMar 21, 1995
Semiconductor device and method of producing the same
FUJITSU LTD16 citations82
US6271583B1Aug 7, 2001
Semiconductor device having resin encapsulated package structure
FUJITSU LTD7 citations74
US5861669AJan 19, 1999
Semiconductor package for surface mounting
FUJITSU LTD10 citations74
US5808357ASep 15, 1998
Semiconductor device having resin encapsulated package structure
FUJITSU LTD11 citations74
US5736428AApr 7, 1998
Process for manufacturing a semiconductor device having a stepped encapsulated package
FUJITSU LTD8 citations73
US4724280AFeb 9, 1988
Package for integrated circuit
FUJITSU LTD12 citations73
US7144754B2Dec 5, 2006
Device having resin package and method of producing the same
FUJITSU LTD1 citations63
US7476811B2Jan 13, 2009
Semiconductor device and manufacturing method therefor
FUJITSU LTD6 citations62
US7361980B2Apr 22, 2008
Semiconductor device
FUJITSU LTD3 citations62
US5293064AMar 8, 1994
Lead frame and method of manufacturing a semiconductor device
FUJITSU LTD6 citations62
US5831332ANov 3, 1998
Semiconductor package for surface mounting
FUJITSU LTD1 citations52
US7042102B2May 9, 2006
Semiconductor device
FUJITSU LTD0 citations51
Showing the top 50 of 51 patents by PatentIndex Score.