P

Inventor

BROOKS MIKE

61 patents
⚠️ This page may combine multiple inventors who share the name “BROOKS MIKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICRON TECHNOLOGY INC

28 patents
US6614104B2Sep 2, 2003

Stackable semiconductor package having conductive layer and insulating layers

MICRON TECHNOLOGY INC220 citations99
US6501165B1Dec 31, 2002

Stackable semiconductor package having conductive layer and insulating layers and method of fabrication

MICRON TECHNOLOGY INC249 citations99
US6465877B1Oct 15, 2002

Semiconductor package including flex circuit, interconnects and dense array external contacts

MICRON TECHNOLOGY INC166 citations99
US6451624B1Sep 17, 2002

Stackable semiconductor package having conductive layer and insulating layers and method of fabrication

MICRON TECHNOLOGY INC220 citations99
US6368896B2Apr 9, 2002

Method of wafer level chip scale packaging

MICRON TECHNOLOGY INC267 citations99
US6326242B1Dec 4, 2001

Semiconductor package with heat sink and method of fabrication

MICRON TECHNOLOGY INC157 citations99
US6097087AAug 1, 2000

Semiconductor package including flex circuit, interconnects and dense array external contacts

MICRON TECHNOLOGY INC539 citations99
US6049125AApr 11, 2000

Semiconductor package with heat sink and method of fabrication

MICRON TECHNOLOGY INC185 citations99
US6020629AFeb 1, 2000

Stacked semiconductor package and method of fabrication

MICRON TECHNOLOGY INC621 citations99
US6740546B2May 25, 2004

Packaged microelectronic devices and methods for assembling microelectronic devices

MICRON TECHNOLOGY INC93 citations98
US6271056B1Aug 7, 2001

Stacked semiconductor package and method of fabrication

MICRON TECHNOLOGY INC120 citations98
US5990566ANov 23, 1999

High density semiconductor package

MICRON TECHNOLOGY INC317 citations98
US6924550B2Aug 2, 2005

Packaged microelectronic devices and methods for assembling microelectronic devices

MICRON TECHNOLOGY INC54 citations96
US6911355B2Jun 28, 2005

Semiconductor package having flex circuit with external contacts

MICRON TECHNOLOGY INC38 citations96
US6891248B2May 10, 2005

Semiconductor component with on board capacitor

MICRON TECHNOLOGY INC50 citations96
US6740960B1May 25, 2004

Semiconductor package including flex circuit, interconnects and dense array external contacts

MICRON TECHNOLOGY INC68 citations96
US6294824B1Sep 25, 2001

Bonding support for leads-over-chip process

MICRON TECHNOLOGY INC45 citations96
US5770479AJun 23, 1998

Bonding support for leads-over-chip process

MICRON TECHNOLOGY INC57 citations96
US5691649ANov 25, 1997

Carrier having slide connectors for testing unpackaged semiconductor dice

MICRON TECHNOLOGY INC65 citations96
US7002248B2Feb 21, 2006

Semiconductor components having multiple on board capacitors

MICRON TECHNOLOGY INC24 citations93
US6975037B2Dec 13, 2005

Semiconductor package having flex circuit with external contacts

MICRON TECHNOLOGY INC18 citations93
US6060893AMay 9, 2000

Carrier having slide connectors for testing unpackaged semiconductor dice

MICRON TECHNOLOGY INC35 citations93
US6210993B1Apr 3, 2001

High density semiconductor package and method of fabrication

MICRON TECHNOLOGY INC22 citations92
US7041537B2May 9, 2006

Method for fabricating semiconductor component with on board capacitor

MICRON TECHNOLOGY INC12 citations84
US7151013B2Dec 19, 2006

Semiconductor package having exposed heat dissipating surface and method of fabrication

MICRON TECHNOLOGY INC10 citations74
US7065868B2Jun 27, 2006

Methods for installing a circuit device

MICRON TECHNOLOGY INC5 citations74
US6681480B1Jan 27, 2004

Method and apparatus for installing a circuit device

MICRON TECHNOLOGY INC6 citations74
US6541856B2Apr 1, 2003

Thermally enhanced high density semiconductor package

MICRON TECHNOLOGY INC8 citations74

ROCKY SHOES & BOOTS INC

16 patents

ROCKY SHOES AND BOOTS INC

6 patents

Showing the top 50 of 61 patents by PatentIndex Score.