Inventor
SINGH INDERJIT
US60 patents
⚠️ This page may combine multiple inventors who share the name “SINGH INDERJIT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NAT SEMICONDUCTOR CORP
11 patentsUS5886393AMar 23, 1999
Bonding wire inductor for use in an integrated circuit package and method
NAT SEMICONDUCTOR CORP119 citations98
US6364089B1Apr 2, 2002
Multi-station rotary die handling device
NAT SEMICONDUCTOR CORP46 citations93
US6213378B1Apr 10, 2001
Method and apparatus for ultra-fine pitch wire bonding
NAT SEMICONDUCTOR CORP33 citations93
US6065667AMay 23, 2000
Method and apparatus for fine pitch wire bonding
NAT SEMICONDUCTOR CORP31 citations93
US5938105AAug 17, 1999
Encapsulated ball bonding apparatus and method
NAT SEMICONDUCTOR CORP32 citations93
US6031216AFeb 29, 2000
Wire bonding methods and apparatus for heat sensitive metallization using a thermally insulated support portion
NAT SEMICONDUCTOR CORP25 citations91
US6489879B1Dec 3, 2002
PTC fuse including external heat source
NAT SEMICONDUCTOR CORP41 citations89
US5780772AJul 14, 1998
Solution to mold wire sweep in fine pitch devices
NAT SEMICONDUCTOR CORP19 citations84
US6255141B1Jul 3, 2001
Method of packaging fuses
NAT SEMICONDUCTOR CORP6 citations74
US6459143B2Oct 1, 2002
Method of packaging fuses
NAT SEMICONDUCTOR CORP2 citations63
US6278191B1Aug 21, 2001
Bond pad sealing using wire bonding
NAT SEMICONDUCTOR CORP5 citations63
XILINX INC
11 patentsUS9418909B1Aug 16, 2016
Stacked silicon package assembly having enhanced lid adhesion
XILINX INC28 citations94
US9865567B1Jan 9, 2018
Heterogeneous integration of integrated circuit device and companion device
XILINX INC33 citations93
US10043730B2Aug 7, 2018
Stacked silicon package assembly having an enhanced lid
XILINX INC19 citations92
US10764996B1Sep 1, 2020
Chip package assembly with composite stiffener
XILINX INC11 citations83
US10840192B1Nov 17, 2020
Stacked silicon package assembly having enhanced stiffener
XILINX INC12 citations82
US10438863B1Oct 8, 2019
Chip package assembly with surface mounted component protection
XILINX INC13 citations82
US9761533B2Sep 12, 2017
Interposer-less stack die interconnect
XILINX INC3 citations73
US9385106B1Jul 5, 2016
Method for providing charge protection to one or more dies during formation of a stacked silicon device
XILINX INC5 citations72
US11075117B2Jul 27, 2021
Die singulation and stacked device structures
XILINX INC1 citations62
US8900987B1Dec 2, 2014
Method for removing bumps from incomplete and defective interposer dies for stacked silicon interconnect technology (SSIT) devices
XILINX INC3 citations61
US11201095B1Dec 14, 2021
Chip package having a cover with window
XILINX INC1 citations56
NVIDIA CORP
6 patentsUS7453158B2Nov 18, 2008
Pad over active circuit system and method with meshed support structure
NVIDIA CORP8 citations72
US7429528B2Sep 30, 2008
Method of fabricating a pad over active circuit I.C. with meshed support structure
NVIDIA CORP5 citations72
US7838999B1Nov 23, 2010
System and method of manufacture for interconnecting an integrated circuit and a substrate
NVIDIA CORP2 citations62
US7791193B2Sep 7, 2010
Pad over active circuit system and method with meshed support structure
NVIDIA CORP3 citations61
US7649269B2Jan 19, 2010
Pad over active circuit system and method with frame support structure
NVIDIA CORP2 citations61
US7495343B1Feb 24, 2009
Pad over active circuit system and method with frame support structure
NVIDIA CORP4 citations61
MUSC FOUND FOR RES DEV
3 patentsUS7049058B2May 23, 2006
Methods for suppressing the induction of nitric oxide synthase in a cell
MUSC FOUND FOR RES DEV72 citations98
US5912019AJun 15, 1999
Compounds for reducing ischemia/reperfusion injury
MUSC FOUND FOR RES DEV61 citations96
US7396659B2Jul 8, 2008
Inhibitors of nitric oxide synthase to treat type 1 diabetes
MUSC FOUND FOR RES DEV15 citations93
SINGH INDERJIT
3 patentsUS9107434B2Aug 18, 2015
Method and apparatus for plasma assisted laser cooking of food products
SINGH INDERJIT10 citations83
US8198727B1Jun 12, 2012
Integrated circuit/substrate interconnect system and method of manufacture
SINGH INDERJIT8 citations81
US8507219B2Aug 13, 2013
Method of treating inflammation with statins
SINGH INDERJIT1 citations62
FAIRCHILD SEMICONDUCTOR
2 patentsTEXAS INSTRUMENTS INC
2 patentsHYSLOP BRADLEY THOMAS
2 patentsNORTEK SECURITY & CONTROL LLC
2 patentsENTROPIC COMMUNICATIONS INC
2 patentsENTROPIC COMMUNICATIONS LLC
2 patentsILLUMINA INC
2 patentsUNIV SOUTH CAROLINA
1 patentJAFARI BEHDAD
1 patentShowing the top 50 of 60 patents by PatentIndex Score.