Inventor
KAWANO MASAYA
JP75 patents
⚠️ This page may combine multiple inventors who share the name “KAWANO MASAYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC ELECTRONICS CORP
16 patentsUS7541677B2Jun 2, 2009
Semiconductor device comprising through-electrode interconnect
NEC ELECTRONICS CORP53 citations98
US7800233B2Sep 21, 2010
Semiconductor device and method of manufacturing the same
NEC ELECTRONICS CORP32 citations93
US7633167B2Dec 15, 2009
Semiconductor device and method for manufacturing same
NEC ELECTRONICS CORP21 citations93
US7598117B2Oct 6, 2009
Method for manufacturing semiconductor module using interconnection structure
NEC ELECTRONICS CORP26 citations93
US7528068B2May 5, 2009
Method for manufacturing semiconductor device
NEC ELECTRONICS CORP26 citations93
US7247935B2Jul 24, 2007
Semiconductor device
NEC ELECTRONICS CORP18 citations93
US7145247B2Dec 5, 2006
Offset-bonded, multi-chip semiconductor device
NEC ELECTRONICS CORP42 citations93
US7033928B2Apr 25, 2006
Method of fabricating semiconductor device
NEC ELECTRONICS CORP16 citations93
US7807567B2Oct 5, 2010
Semiconductor device with interconnection structure for reducing stress migration
NEC ELECTRONICS CORP29 citations92
US7538022B2May 26, 2009
Method of manufacturing electronic circuit device
NEC ELECTRONICS CORP8 citations84
US7768133B2Aug 3, 2010
Semiconductor device and semiconductor module employing thereof
NEC ELECTRONICS CORP7 citations74
US7405472B2Jul 29, 2008
Semiconductor device
NEC ELECTRONICS CORP7 citations74
US7759786B2Jul 20, 2010
Electronic circuit chip, and electronic circuit device and method for manufacturing the same
NEC ELECTRONICS CORP5 citations63
US7656046B2Feb 2, 2010
Semiconductor device
NEC ELECTRONICS CORP6 citations63
US7598590B2Oct 6, 2009
Semiconductor chip and method for manufacturing the same and semiconductor device
NEC ELECTRONICS CORP2 citations63
US7262486B2Aug 28, 2007
SOI substrate and method for manufacturing the same
NEC ELECTRONICS CORP3 citations63
RENESAS ELECTRONICS CORP
13 patentsUS9406602B2Aug 2, 2016
Electronic device
RENESAS ELECTRONICS CORP9 citations93
US8633591B2Jan 21, 2014
Electronic device
RENESAS ELECTRONICS CORP10 citations93
US8354340B2Jan 15, 2013
Electronic device and method of manufacturing the same
RENESAS ELECTRONICS CORP23 citations93
US8035231B2Oct 11, 2011
Semiconductor device and method of manufacturing the same
RENESAS ELECTRONICS CORP17 citations93
US10224318B2Mar 5, 2019
Electronic device
RENESAS ELECTRONICS CORP6 citations84
US9847325B2Dec 19, 2017
Electronic device
RENESAS ELECTRONICS CORP3 citations84
US8975750B2Mar 10, 2015
Electronic device
RENESAS ELECTRONICS CORP7 citations84
US8823174B2Sep 2, 2014
Electronic device
RENESAS ELECTRONICS CORP7 citations84
US7928001B2Apr 19, 2011
Electronic device and method of manufacturing the same
RENESAS ELECTRONICS CORP14 citations84
US7892973B2Feb 22, 2011
Method for manufacturing a semiconductor device
RENESAS ELECTRONICS CORP9 citations84
US8008191B2Aug 30, 2011
Semiconductor device and method for manufacturing the same
RENESAS ELECTRONICS CORP4 citations74
US8022529B2Sep 20, 2011
Semiconductor device and method for manufacturing the same
RENESAS ELECTRONICS CORP3 citations63
US7927999B2Apr 19, 2011
Method of forming metal interconnect layers for flip chip device
RENESAS ELECTRONICS CORP2 citations63
KAWANO MASAYA
8 patentsUS8058165B2Nov 15, 2011
Semiconductor device and method of manufacturing the same
KAWANO MASAYA17 citations92
US8830694B2Sep 9, 2014
Circuit device
KAWANO MASAYA4 citations84
US8395269B2Mar 12, 2013
Method of stacking semiconductor chips including forming an interconnect member and a through electrode
KAWANO MASAYA10 citations84
US8115312B2Feb 14, 2012
Semiconductor device having a through electrode
KAWANO MASAYA7 citations84
US8085549B2Dec 27, 2011
Circuit device
KAWANO MASAYA4 citations74
US8456019B2Jun 4, 2013
Semiconductor device
KAWANO MASAYA1 citations63
US8183685B2May 22, 2012
Semiconductor device
KAWANO MASAYA1 citations63
US8143716B2Mar 27, 2012
Semiconductor device with plate-shaped component
KAWANO MASAYA5 citations63
NEC CORP
7 patentsUS6205658B1Mar 27, 2001
Method for formation of metal wiring
NEC CORP22 citations93
US5581117ADec 3, 1996
Si base substrate covered by a CdTe or Cd-rich CdZnTe layer
NEC CORP25 citations93
US5759266AJun 2, 1998
Method for growing a CdTe layer on a Si substrate by a molecular beam epitaxy
NEC CORP17 citations84
US8035217B2Oct 11, 2011
Semiconductor device and method for manufacturing same
NEC CORP9 citations83
US6437331B1Aug 20, 2002
Bolometer type infrared sensor with material having hysterisis
NEC CORP9 citations74
US5574958ANov 12, 1996
Hydrogen radical producing apparatus
NEC CORP10 citations74
US5477809ADec 26, 1995
Method of growth of CdTe on silicon by molecular beam epitaxy
NEC CORP9 citations74
NEC RESEARCH INST
1 patentKIKUCHI KATSUMI
1 patentMORI KENTARO
1 patentSOEJIMA KOJI
1 patentNEC RESEARCH INST INC
1 patentTAKAHASHI NOBUAKI
1 patentShowing the top 50 of 75 patents by PatentIndex Score.