Inventor

TANG JIANSHE

US53 patents

⚠️ This page may combine multiple inventors who share the name “TANG JIANSHE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TANG JIANSHE

APPLIED MATERIALS INC

Method and apparatus for cleaning the edge of a thin disc

Acoustic emission monitoring and endpoint for chemical mechanical polishing

Method and apparatus for cleaning the edge of a thin disc

Continuous cleaning megasonic tank with reduced duty cycle transducers

Method and apparatus for cleaning the edge of a thin disc

Carrier head with a modified flexible membrane

Single wafer dryer and drying methods

Single wafer dryer and drying methods

Steam treatment stations for chemical mechanical polishing system

Megasonic resonator for disk cleaning and method for use thereof

Cleaning submicron structures on a semiconductor wafer surface

Single wafer dryer and drying methods

Continuous cleaning megasonic tank with reduced duty cycle transducers

Method and apparatus for cleaning the edge of a thin disc

Wafer edge asymmetry correction using groove in polishing pad

Use of steam for pre-heating of CMP components

Temperature control of chemical mechanical polishing

Slurry distribution device for chemical mechanical polishing

Slurry distribution device for chemical mechanical polishing

Methods and apparatus for forming dual metal interconnects

Apparatus and method for CMP temperature control

Apparatus and method of substrate edge cleaning and substrate carrier head gap cleaning

Apparatus and method of substrate edge cleaning and substrate carrier head gap cleaning

Frontside structure damage protected megasonics clean

Determining the orientation of a substrate in-situ

Steam treatment stations for chemical mechanical polishing system

Method for CMP temperature control

Apparatus and method for CMP temperature control

Apparatus and method for CMP temperature control

Steam treatment stations for chemical mechanical polishing system

Low-temperature metal CMP for minimizing dishing and corrosion, and improving pad asperity

Temperature-based in-situ edge assymetry correction during CMP

Chemical mechanical polishing temperature scanning apparatus for temperature control

Steam cleaning of CMP components

Chemical mechanical polishing using time share control

Overpolishing based on electromagnetic inductive monitoring of trench depth

In-situ conditioner disk cleaning during CMP

Slurry distribution device for chemical mechanical polishing

Slurry distribution device for chemical mechanical polishing

Wafer edge asymmetry correction using groove in polishing pad

Steam-assisted single substrate cleaning process and apparatus

Methods and apparatus for forming dual metal interconnects

Chemical mechanical polishing using time share control

Steam-assisted single substrate cleaning process and apparatus

Temperature-based assymetry correction during CMP and nozzle for media dispensing

Megasonic wafer cleaning tank with reflector for improved wafer edge cleaning

Temperature and slurry flow rate control in CMP

UNIV CALIFORNIA

Semiconductor wafer chemical-mechanical planarization process monitoring and end-point detection method and apparatus

Semiconductor wafer chemical-mechanical planarization process monitoring and end-point detection method and apparatus

TANG JIANSHE

Network camera