Inventor
LAI CHIEN-HSIN
TW29 patents
⚠️ This page may combine multiple inventors who share the name “LAI CHIEN-HSIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
28 patentsUS6120366ASep 19, 2000
Chemical-mechanical polishing pad
UNITED MICROELECTRONICS CORP99 citations97
US6293850B1Sep 25, 2001
Chemical-mechanical polish machines and fabrication process using the same
UNITED MICROELECTRONICS CORP28 citations92
US6183350B1Feb 6, 2001
Chemical-mechanical polish machines and fabrication process using the same
UNITED MICROELECTRONICS CORP28 citations92
US6220930B1Apr 24, 2001
Wafer polishing head
UNITED MICROELECTRONICS CORP23 citations91
US7264676B2Sep 4, 2007
Plasma apparatus and method capable of adaptive impedance matching
UNITED MICROELECTRONICS CORP21 citations83
US6341995B1Jan 29, 2002
Chemical mechanical polishing apparatus
UNITED MICROELECTRONICS CORP15 citations83
US6036356AMar 14, 2000
In-situ slurry mixing apparatus
UNITED MICROELECTRONICS CORP17 citations83
US6721628B1Apr 13, 2004
Closed loop concentration control system for chemical mechanical polishing slurry
UNITED MICROELECTRONICS CORP16 citations80
US6241582B1Jun 5, 2001
Chemical mechanical polish machines and fabrication process using the same
UNITED MICROELECTRONICS CORP6 citations73
US6206758B1Mar 27, 2001
Method for increasing working life of retaining ring in chemical-mechanical polishing machine
UNITED MICROELECTRONICS CORP9 citations73
US6129043AOct 10, 2000
Gas tube with heating apparatus
UNITED MICROELECTRONICS CORP14 citations73
US6119294ASep 19, 2000
Cleaning system with automatically controlled brush pressure
UNITED MICROELECTRONICS CORP8 citations73
US6062963AMay 16, 2000
Retainer ring design for polishing head of chemical-mechanical polishing machine
UNITED MICROELECTRONICS CORP10 citations73
US6682399B1Jan 27, 2004
Pressure monitoring system for chemical-mechanical polishing
UNITED MICROELECTRONICS CORP10 citations72
US6569771B2May 27, 2003
Carrier head for chemical mechanical polishing
UNITED MICROELECTRONICS CORP10 citations72
US6416615B1Jul 9, 2002
Device for detecting abnormality in chemical-mechanical polishing operation
UNITED MICROELECTRONICS CORP8 citations72
US6096162AAug 1, 2000
Chemical mechanical polishing machine
UNITED MICROELECTRONICS CORP7 citations72
US6648729B2Nov 18, 2003
Wafer pressure regulation system for polishing machine
UNITED MICROELECTRONICS CORP8 citations70
US7569111B2Aug 4, 2009
Method of cleaning deposition chamber
UNITED MICROELECTRONICS CORP2 citations62
US6352244B2Mar 5, 2002
Auxiliary gasline-heating unit in chemical vapor deposition
UNITED MICROELECTRONICS CORP2 citations62
US6322057B1Nov 27, 2001
Auxiliary gasline-heating unit in chemical vapor deposition
UNITED MICROELECTRONICS CORP2 citations62
US6307163B1Oct 23, 2001
Chemical mixer tank calibrator and calibrating method for the same
UNITED MICROELECTRONICS CORP2 citations62
US6051139AApr 18, 2000
Device for filtering slurry
UNITED MICROELECTRONICS CORP6 citations62
US6228420B1May 8, 2001
Method to maintain consistent thickness of thin film deposited by chemical vapor deposition
UNITED MICROELECTRONICS CORP6 citations61
US6165255ADec 26, 2000
Chemical-liquid controlling apparatus
UNITED MICROELECTRONICS CORP2 citations61
US6267654B1Jul 31, 2001
Pad backer for polishing head of chemical mechanical polishing machine
UNITED MICROELECTRONICS CORP0 citations51
US6234876B1May 22, 2001
Chemical-mechanical polish machines and fabrication process using the same
UNITED MICROELECTRONICS CORP0 citations51
US6676801B2Jan 13, 2004
Pressure suppression device for chemical mechanical polishing machine and method thereof
UNITED MICROELECTRONICS CORP1 citations50