Inventor

LAI CANFENG

US35 patents

⚠️ This page may combine multiple inventors who share the name “LAI CANFENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LAI CANFENG

APPLIED MATERIALS INC

In situ application of etch back for improved deposition into high-aspect-ratio features

Semiconductor device fabrication chamber cleaning method and apparatus with recirculation of cleaning gas

Multi-core transformer plasma source

High-permeability magnetic shield for improved process uniformity in nonmagnetized plasma process chambers

Toroidal plasma source for plasma processing

Directing a flow of gas in a substrate processing chamber

Multi-core transformer plasma source

Non-intrusive plasma probe

Atmospheric substrate processing apparatus for depositing multiple layers on a substrate

Plasma assisted semiconductor substrate processing chamber having a plurality of ground path bridges

Substrate support with extended radio frequency electrode upper surface

Internal balanced coil for inductively coupled high density plasma processing chamber

Internal balanced coil for inductively coupled high density plasma processing chamber

Two-piece dome with separate RF coils for inductively coupled plasma reactors

Toroidal plasma source for plasma processing

Method and apparatus for selective nitridation process

Inductive plasma source with metallic shower head using B-field concentrator

Magnetic holding structures for plasma processing applications

Chamber clean method using remote and in situ plasma cleaning systems

Semiconductor processing chambers for deposition and etch

Inductive plasma source with metallic shower head using b-field concentrator

Methods and apparatus for processing substrates using an ion shield

In situ application of etch back for improved deposition into high-aspect-ratio features

Radio frequency conduit

Method and apparatus for selective nitridation process

Plasma immersion ion implantation process with chamber seasoning and seasoning layer plasma discharging for wafer dechucking

Low-frequency bias power in HDP-CVD processes

Single chamber flowable film formation and treatments

Showerhead design to control stray deposition

Semiconductor processing chambers and methods for deposition and etch

Plasma immersion ion implantation process with chamber seasoning and seasoning layer plasma discharging for wafer dechucking

Magnetic-material shield around plasma chambers near pedestal

LAM RES CORP

Unbalanced bipolar electrostatic chuck power supplies and methods thereof

Chamber member of a plasma source and pedestal with radially outward positioned lift pins for translation of a substrate c-ring

LAI CANFENG

Ceiling electrode with process gas dispersers housing plural inductive RF power applicators extending into the plasma