Inventor
MIYAZAWA WAKAO
JP17 patents
Patents
17 patentsUS7468308B2Dec 23, 2008
Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same
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US7285476B2Oct 23, 2007
Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same
SEIKO EPSON CORP124 citations99
US7094665B2Aug 22, 2006
Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same
SEIKO EPSON CORP209 citations99
US6878607B2Apr 12, 2005
Thin film device transfer method, thin film device, thin film integrated circuit device, active matrix board, liquid crystal display, and electronic apparatus
SEIKO EPSON CORP281 citations99
US6818530B2Nov 16, 2004
Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same
SEIKO EPSON CORP715 citations99
US6645830B2Nov 11, 2003
Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device and liquid crystal display device produced by the same
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US6521511B1Feb 18, 2003
Thin film device transfer method, thin film device, thin film integrated circuit device, active matrix board, liquid crystal display, and electronic apparatus
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US6372608B1Apr 16, 2002
Separating method, method for transferring thin film device, thin film device, thin film integrated circuit device, and liquid crystal display device manufactured by using the transferring method
SEIKO EPSON CORP1,132 citations99
US5989945ANov 23, 1999
Thin film device provided with coating film, liquid crystal panel and electronic device, and method for making the thin film device
SEIKO EPSON CORP182 citations99
US6593591B2Jul 15, 2003
Thin film device provided with coating film, liquid crystal panel and electronic device, and method the thin film device
SEIKO EPSON CORP86 citations98
US7127810B2Oct 31, 2006
Method of manufacturing electronic device including aligning first substrate, second substrate and mask, and transferring object from first substrate to second substrate, including irradiating object on first substrate with light through mask
SEIKO EPSON CORP112 citations95
US7090139B2Aug 15, 2006
IC card and method of manufacturing the same
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US7229859B2Jun 12, 2007
Thin film device provided with coating film, liquid crystal panel and electronic device, and method for making the thin film device
SEIKO EPSON CORP27 citations93
US7067337B2Jun 27, 2006
Thin film device provided with coating film, liquid crystal panel and electronic device, and method for making the thin film device
SEIKO EPSON CORP27 citations93
US7526858B2May 5, 2009
Apparatus for making electronic devices
SEIKO EPSON CORP17 citations90
US7101729B2Sep 5, 2006
Method of manufacturing a semiconductor device having adjoining substrates
SEIKO EPSON CORP18 citations84
US7341894B2Mar 11, 2008
Semiconductor, electrooptic apparatus and electronic apparatus
SEIKO EPSON CORP3 citations58