Inventor
KOBAYASHI NORIHIRO
JP58 patents
⚠️ This page may combine multiple inventors who share the name “KOBAYASHI NORIHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINETSU HANDOTAI KK
42 patentsUS6391796B1May 21, 2002
Method for heat-treating silicon wafer and silicon wafer
SHINETSU HANDOTAI KK61 citations96
US6362076B1Mar 26, 2002
Method of fabricating an SOI wafer by hydrogen ion delamination without independent bonding heat treatment
SHINETSU HANDOTAI KK54 citations96
US6191009B1Feb 20, 2001
Method for producing silicon single crystal wafer and silicon single crystal wafer
SHINETSU HANDOTAI KK57 citations96
US6238990B1May 29, 2001
Method for heat treatment of SOI wafer and SOI wafer heat-treated by the method
SHINETSU HANDOTAI KK19 citations93
US7147711B2Dec 12, 2006
Method of producing silicon wafer and silicon wafer
SHINETSU HANDOTAI KK22 citations92
US6573159B1Jun 3, 2003
Method for thermally annealing silicon wafer and silicon wafer
SHINETSU HANDOTAI KK29 citations92
US6413310B1Jul 2, 2002
Method for producing silicon single crystal wafer and silicon single crystal wafer
SHINETSU HANDOTAI KK45 citations92
US6139625AOct 31, 2000
Method for producing a silicon single crystal wafer and a silicon single crystal wafer
SHINETSU HANDOTAI KK27 citations92
US6461939B1Oct 8, 2002
SOI wafers and methods for producing SOI wafer
SHINETSU HANDOTAI KK42 citations91
US5998283ADec 7, 1999
Silicon wafer having plasma CVD gettering layer with components/composition changing in depth-wise direction and method of manufacturing the silicon wafer
SHINETSU HANDOTAI KK19 citations91
US6245311B1Jun 12, 2001
Method for heat treatment of silicon wafer and silicon wafer
SHINETSU HANDOTAI KK38 citations90
US5863659AJan 26, 1999
Silicon wafer, and method of manufacturing the same
SHINETSU HANDOTAI KK20 citations86
US7861421B2Jan 4, 2011
Method for measuring rotation angle of bonded wafer
SHINETSU HANDOTAI KK8 citations83
US6531416B1Mar 11, 2003
Method for heat treatment of silicon wafer and silicon wafer heat-treated by the method
SHINETSU HANDOTAI KK15 citations82
US6809015B2Oct 26, 2004
Method for heat treatment of silicon wafers and silicon wafer
SHINETSU HANDOTAI KK9 citations74
US6551398B2Apr 22, 2003
Heat treatment method for a silicon monocrystal wafer and a silicon monocrystal wafer
SHINETSU HANDOTAI KK9 citations74
US6403502B1Jun 11, 2002
Heat treatment method for a silicon wafer and a silicon wafer heat-treated by the method
SHINETSU HANDOTAI KK6 citations74
US6204188B1Mar 20, 2001
Heat treatment method for a silicon wafer and a silicon wafer heat-treated by the method
SHINETSU HANDOTAI KK10 citations74
US9793154B2Oct 17, 2017
Method for manufacturing bonded SOI wafer
SHINETSU HANDOTAI KK2 citations73
US7189293B2Mar 13, 2007
Method of producing annealed wafer and annealed wafer
SHINETSU HANDOTAI KK7 citations73
US9735045B2Aug 15, 2017
Method of fabricating SOI wafer by ion implantation
SHINETSU HANDOTAI KK2 citations72
US7081422B2Jul 25, 2006
Manufacturing process for annealed wafer and annealed wafer
SHINETSU HANDOTAI KK8 citations72
US5993493ANov 30, 1999
Method of manufacturing mirror-polished silicon wafers, and apparatus for processing silicon wafers
SHINETSU HANDOTAI KK7 citations72
US5759426AJun 2, 1998
Heat treatment jig for semiconductor wafers and a method for treating a surface of the same
SHINETSU HANDOTAI KK11 citations71
US7011717B2Mar 14, 2006
Method for heat treatment of silicon wafers and silicon wafer
SHINETSU HANDOTAI KK2 citations63
US6878645B2Apr 12, 2005
Method for manufacturing silicon wafer
SHINETSU HANDOTAI KK3 citations63
US7902042B2Mar 8, 2011
Method of manufacturing SOI wafer and thus-manufactured SOI wafer
SHINETSU HANDOTAI KK2 citations62
US6841450B2Jan 11, 2005
Annealed wafer manufacturing method and annealed wafer
SHINETSU HANDOTAI KK3 citations62
US6805743B2Oct 19, 2004
Method for manufacturing single-crystal-silicon wafers
SHINETSU HANDOTAI KK4 citations62
US7153785B2Dec 26, 2006
Method of producing annealed wafer and annealed wafer
SHINETSU HANDOTAI KK5 citations61
US10529615B2Jan 7, 2020
Method for manufacturing a bonded SOI wafer and bonded SOI wafer
SHINETSU HANDOTAI KK1 citations58
US9076840B2Jul 7, 2015
Method for manufacturing a bonded SOI wafer
SHINETSU HANDOTAI KK1 citations52
US6806199B2Oct 19, 2004
Method for manufacturing silicon mirror wafer, silicon mirror wafer, and heat treatment furnace
SHINETSU HANDOTAI KK1 citations52
US6670261B2Dec 30, 2003
Production method for annealed wafer
SHINETSU HANDOTAI KK1 citations52
US6544899B2Apr 8, 2003
Process for manufacturing silicon epitaxial wafer
SHINETSU HANDOTAI KK1 citations52
US6538285B2Mar 25, 2003
Silicon wafer
SHINETSU HANDOTAI KK0 citations52
US6333279B1Dec 25, 2001
Method for producing silicon wafer and silicon wafer
SHINETSU HANDOTAI KK1 citations52
US7521334B2Apr 21, 2009
Method for producing direct bonded wafer and direct bonded wafer
SHINETSU HANDOTAI KK0 citations49
US10490440B2Nov 26, 2019
Method for manufacturing bonded SOI wafer
SHINETSU HANDOTAI KK0 citations42
US10204824B2Feb 12, 2019
Method for producing SOI wafer
SHINETSU HANDOTAI KK0 citations42
US9859149B2Jan 2, 2018
Method of producing bonded wafer with uniform thickness distribution
SHINETSU HANDOTAI KK0 citations42
US9773694B2Sep 26, 2017
Method for manufacturing bonded wafer
SHINETSU HANDOTAI KK0 citations42
FUJITSU LTD
2 patentsKOBAYASHI NORIHIRO
2 patentsHITACHI LTD
1 patentKATO MASAHIRO
1 patentSHIN ETSU HANDOTAI LTD
1 patentISHIZUKA TOHRU
1 patentShowing the top 50 of 58 patents by PatentIndex Score.