Inventor

YEH MENG-HUNG

TW2 patents

Patents

2 patents

US9355989B2May 31, 2016

Wire bonding device and method of eliminating defective bonding wire

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations43

US9289846B2Mar 22, 2016

Method for fabricating wire bonding structure

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations39