Inventor
WATWE ABHAY A
US8 patents
Patents
8 patentsUS6653730B2Nov 25, 2003
Electronic assembly with high capacity thermal interface
INTEL CORP83 citations97
US6661660B2Dec 9, 2003
Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment
INTEL CORP72 citations95
US6639799B2Oct 28, 2003
Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment
INTEL CORP67 citations95
US6770966B2Aug 3, 2004
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat
INTEL CORP21 citations92
US7170098B2Jan 30, 2007
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat
INTEL CORP8 citations73
US7098079B2Aug 29, 2006
Electronic assembly with high capacity thermal interface and methods of manufacture
INTEL CORP8 citations73
US6921706B2Jul 26, 2005
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat
INTEL CORP8 citations73
US7432532B2Oct 7, 2008
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat
INTEL CORP1 citations62