Inventor

KOVITSOPHON WICHAI

TH2 patents

Patents

2 patents

US11887864B2Jan 30, 2024

Method of forming a surface-mount integrated circuit package with solder enhanced leadframe terminals

MICROCHIP TECH INC0 citations38

US11145574B2Oct 12, 2021

Semiconductor device packages with electrical routing improvements and related methods

MICROCHIP TECH INC0 citations34