Inventor
MIYAKAWA TAKESHI
JP49 patents
⚠️ This page may combine multiple inventors who share the name “MIYAKAWA TAKESHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DENKI KAGAKU KOGYO KK
15 patentsUS5747164AMay 5, 1998
Conductive composite plastic sheet and container
DENKI KAGAKU KOGYO KK27 citations92
US5415906AMay 16, 1995
Heat resistant electrically conductive plastic sheet and container
DENKI KAGAKU KOGYO KK25 citations90
US7014896B1Mar 21, 2006
Packaging container for electronic part
DENKI KAGAKU KOGYO KK12 citations81
US5955164ASep 21, 1999
Electroconductive resin composition, sheet, molded product and container
DENKI KAGAKU KOGYO KK7 citations74
US5876632AMar 2, 1999
Electroconductive resin composition, sheet, molded product and container
DENKI KAGAKU KOGYO KK10 citations74
US5707699AJan 13, 1998
Electroconductive resin composition, sheet, molded product and container
DENKI KAGAKU KOGYO KK12 citations74
US7455896B2Nov 25, 2008
Electronic component container
DENKI KAGAKU KOGYO KK8 citations73
US6759130B2Jul 6, 2004
Resin composition, molded product thereof and electroconductive sheet
DENKI KAGAKU KOGYO KK5 citations73
US6485832B1Nov 26, 2002
Resin composition, molded product thereof and electroconductive sheet
DENKI KAGAKU KOGYO KK10 citations73
US7364778B2Apr 29, 2008
Container for an electronic component
DENKI KAGAKU KOGYO KK7 citations70
US6960390B2Nov 1, 2005
Resin composition, molded product thereof and electroconductive sheet
DENKI KAGAKU KOGYO KK2 citations62
US7097900B2Aug 29, 2006
Sheet and electronic component packaging container
DENKI KAGAKU KOGYO KK3 citations60
US7199187B2Apr 3, 2007
Sheet
DENKI KAGAKU KOGYO KK0 citations49
US7794807B2Sep 14, 2010
Conductive composite sheeting
DENKI KAGAKU KOGYO KK1 citations48
US7261840B2Aug 28, 2007
Electroconductive resin composition
DENKI KAGAKU KOGYO KK0 citations48
DENKA COMPANY LTD
15 patentsUS10358704B2Jul 23, 2019
Composite body and method for manufacturing same
DENKA COMPANY LTD5 citations71
US9872380B2Jan 16, 2018
Ceramic circuit board and method for producing same
DENKA COMPANY LTD2 citations69
US10869413B2Dec 15, 2020
Heat-dissipating component and method for manufacturing same
DENKA COMPANY LTD2 citations68
US11682604B2Jun 20, 2023
Heat dissipation component and method for manufacturing same
DENKA COMPANY LTD0 citations62
US10751912B2Aug 25, 2020
Aluminum-diamond-based composite and method for producing same
DENKA COMPANY LTD1 citations62
US10636723B2Apr 28, 2020
Heat dissipation component and method for manufacturing same
DENKA COMPANY LTD1 citations62
US10541189B2Jan 21, 2020
Heat dissipation component for semiconductor element
DENKA COMPANY LTD1 citations62
US10919811B2Feb 16, 2021
Aluminum-silicon-carbide composite and method of manufacturing same
DENKA COMPANY LTD1 citations61
US10302375B2May 28, 2019
Aluminum-diamond composite, and heat dissipating component using same
DENKA COMPANY LTD1 citations61
US11296008B2Apr 5, 2022
Aluminum-silicon carbide composite and production method therefor
DENKA COMPANY LTD1 citations59
US10640853B2May 5, 2020
Aluminum-diamond-based composite and heat dissipation component
DENKA COMPANY LTD1 citations59
US10529591B2Jan 7, 2020
Method for producing silicon carbide composite material
DENKA COMPANY LTD0 citations52
US10424529B2Sep 24, 2019
Ceramic circuit board
DENKA COMPANY LTD0 citations45
US10081055B2Sep 25, 2018
Composite body and method for producing same
DENKA COMPANY LTD0 citations42
US10539379B2Jan 21, 2020
Heat dissipation component for semiconductor element
DENKA COMPANY LTD0 citations38
MIYAKAWA TAKESHI
8 patentsUSD575081SAug 19, 2008
Table
MIYAKAWA TAKESHI15 citations84
USD571114SJun 17, 2008
Chair
MIYAKAWA TAKESHI9 citations84
USD580668SNov 18, 2008
Chair
MIYAKAWA TAKESHI8 citations73
US7832797B2Nov 16, 2010
Foldable furniture
MIYAKAWA TAKESHI2 citations62
USD609031SFeb 2, 2010
Table
MIYAKAWA TAKESHI5 citations62
USD600472SSep 22, 2009
Chest of drawers
MIYAKAWA TAKESHI1 citations52
USD555370SNov 20, 2007
Foldable chair/table
MIYAKAWA TAKESHI1 citations52
US8449143B2May 28, 2013
Metal base circuit board
MIYAKAWA TAKESHI1 citations48
TOSHIBA KK
5 patentsUS7291866B2Nov 6, 2007
Semiconductor light emitting device and semiconductor light emitting unit
TOSHIBA KK31 citations92
US9275921B2Mar 1, 2016
Semiconductor device
TOSHIBA KK6 citations73
US9362192B2Jun 7, 2016
Semiconductor device comprising heat dissipating connector
TOSHIBA KK4 citations71
US9171817B2Oct 27, 2015
Semiconductor device
TOSHIBA KK1 citations52
USD556128SNov 27, 2007
Optical transmission conversion device
TOSHIBA KK0 citations52