Inventor
SONG KUNHO
KR3 patents
Patents
3 patentsUS7989939B2Aug 2, 2011
Semiconductor package which includes an insulating layer located between package substrates which may prevent an electrical short caused by a bonding wire
SAMSUNG ELECTRONICS CO LTD3 citations55
US10211084B2Feb 19, 2019
Chuck table and substrate processing system including the same
SAMSUNG ELECTRONICS CO LTD0 citations47
US10418259B2Sep 17, 2019
Apparatus for laminating a tape film on a substrate and a system of fabricating a semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD0 citations45