Inventor
BYUN JEONG SOO
US54 patents
⚠️ This page may combine multiple inventors who share the name “BYUN JEONG SOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
31 patentsUS7208413B2Apr 24, 2007
Formation of boride barrier layers using chemisorption techniques
APPLIED MATERIALS INC536 citations99
US6936538B2Aug 30, 2005
Method and apparatus for depositing tungsten after surface treatment to improve film characteristics
APPLIED MATERIALS INC135 citations99
US6903031B2Jun 7, 2005
In-situ-etch-assisted HDP deposition using SiF4 and hydrogen
APPLIED MATERIALS INC111 citations99
US6831004B2Dec 14, 2004
Formation of boride barrier layers using chemisorption techniques
APPLIED MATERIALS INC533 citations99
US6620723B1Sep 16, 2003
Formation of boride barrier layers using chemisorption techniques
APPLIED MATERIALS INC204 citations99
US6551929B1Apr 22, 2003
Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques
APPLIED MATERIALS INC396 citations99
US6939804B2Sep 6, 2005
Formation of composite tungsten films
APPLIED MATERIALS INC116 citations98
US7745333B2Jun 29, 2010
Methods for depositing tungsten layers employing atomic layer deposition techniques
APPLIED MATERIALS INC47 citations97
US7674715B2Mar 9, 2010
Method for forming tungsten materials during vapor deposition processes
APPLIED MATERIALS INC35 citations96
US7501343B2Mar 10, 2009
Formation of boride barrier layers using chemisorption techniques
APPLIED MATERIALS INC47 citations96
US7501344B2Mar 10, 2009
Formation of boride barrier layers using chemisorption techniques
APPLIED MATERIALS INC44 citations96
US7465666B2Dec 16, 2008
Method for forming tungsten materials during vapor deposition processes
APPLIED MATERIALS INC47 citations96
US7405158B2Jul 29, 2008
Methods for depositing tungsten layers employing atomic layer deposition techniques
APPLIED MATERIALS INC105 citations96
US7235486B2Jun 26, 2007
Method for forming tungsten materials during vapor deposition processes
APPLIED MATERIALS INC43 citations96
US7115494B2Oct 3, 2006
Method and system for controlling the presence of fluorine in refractory metal layers
APPLIED MATERIALS INC30 citations96
US7085616B2Aug 1, 2006
Atomic layer deposition apparatus
APPLIED MATERIALS INC42 citations96
US7033922B2Apr 25, 2006
Method and system for controlling the presence of fluorine in refractory metal layers
APPLIED MATERIALS INC30 citations96
US6855368B1Feb 15, 2005
Method and system for controlling the presence of fluorine in refractory metal layers
APPLIED MATERIALS INC58 citations96
US6849545B2Feb 1, 2005
System and method to form a composite film stack utilizing sequential deposition techniques
APPLIED MATERIALS INC54 citations96
US7605083B2Oct 20, 2009
Formation of composite tungsten films
APPLIED MATERIALS INC39 citations95
US7846840B2Dec 7, 2010
Method for forming tungsten materials during vapor deposition processes
APPLIED MATERIALS INC19 citations93
US7749815B2Jul 6, 2010
Methods for depositing tungsten after surface treatment
APPLIED MATERIALS INC33 citations93
US7238552B2Jul 3, 2007
Method and apparatus for depositing tungsten after surface treatment to improve film characteristics
APPLIED MATERIALS INC18 citations93
US7384867B2Jun 10, 2008
Formation of composite tungsten films
APPLIED MATERIALS INC16 citations92
US7033945B2Apr 25, 2006
Gap filling with a composite layer
APPLIED MATERIALS INC43 citations92
US8027746B2Sep 27, 2011
Atomic layer deposition apparatus
APPLIED MATERIALS INC4 citations74
US7860597B2Dec 28, 2010
Atomic layer deposition apparatus
APPLIED MATERIALS INC5 citations74
US7660644B2Feb 9, 2010
Atomic layer deposition apparatus
APPLIED MATERIALS INC4 citations74
US7294588B2Nov 13, 2007
In-situ-etch-assisted HDP deposition
APPLIED MATERIALS INC5 citations74
US7049211B2May 23, 2006
In-situ-etch-assisted HDP deposition using SiF4
APPLIED MATERIALS INC6 citations74
US9031685B2May 12, 2015
Atomic layer deposition apparatus
APPLIED MATERIALS INC1 citations63
LG SEMICON CO LTD
9 patentsUS5668040ASep 16, 1997
Method for forming a semiconductor device electrode which also serves as a diffusion barrier
LG SEMICON CO LTD64 citations96
US6171981B1Jan 9, 2001
Electrode passivation layer of semiconductor device and method for forming the same
LG SEMICON CO LTD21 citations93
US5824600AOct 20, 1998
Method for forming a silicide layer in a semiconductor device
LG SEMICON CO LTD19 citations93
US5645887AJul 8, 1997
Method for forming platinum silicide plugs
LG SEMICON CO LTD34 citations93
US6096630AAug 1, 2000
Method for fabricating semiconductor device
LG SEMICON CO LTD36 citations92
US5712181AJan 27, 1998
Method for the formation of polycide gate in semiconductor device
LG SEMICON CO LTD36 citations92
US6077750AJun 20, 2000
Method for forming epitaxial Co self-align silicide for semiconductor device
LG SEMICON CO LTD13 citations74
US5744398AApr 28, 1998
Method of forming electrode of semiconductor device
LG SEMICON CO LTD12 citations74
US5665209ASep 9, 1997
Method for forming refractory metal nitride film
LG SEMICON CO LTD16 citations74
CYPRESS SEMICONDUCTOR CORP
4 patentsUS9406574B1Aug 2, 2016
Oxide formation in a plasma process
CYPRESS SEMICONDUCTOR CORP12 citations93
US10304968B2May 28, 2019
Radical oxidation process for fabricating a nonvolatile charge trap memory device
CYPRESS SEMICONDUCTOR CORP8 citations84
US9460974B1Oct 4, 2016
Oxide formation in a plasma process
CYPRESS SEMICONDUCTOR CORP6 citations84
US10128258B2Nov 13, 2018
Oxide formation in a plasma process
CYPRESS SEMICONDUCTOR CORP1 citations63
BYUN JEONG SOO
2 patentsLongitude Flash Memory Solutions Ltd
1 patentHYUNDAI ELECTRONICS IND
1 patentCHIN BARRY L
1 patentPOLISHCHUK IGOR
1 patentShowing the top 50 of 54 patents by PatentIndex Score.