Inventor
BACHMAN MARK ADAM
US7 patents
Patents
7 patentsUS7328830B2Feb 12, 2008
Structure and method for bonding to copper interconnect structures
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US6960836B2Nov 1, 2005
Reinforced bond pad
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US7777333B2Aug 17, 2010
Structure and method for fabricating flip chip devices
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US7221173B2May 22, 2007
Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process
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US7724359B2May 25, 2010
Method of making electronic entities
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US7479695B2Jan 20, 2009
Low thermal resistance assembly for flip chip applications
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US7671436B2Mar 2, 2010
Electronic packages
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