Inventor
CHESIRE DANIEL PATRICK
US8 patents
Patents
8 patentsUS7115985B2Oct 3, 2006
Reinforced bond pad for a semiconductor device
AGERE SYSTEMS INC65 citations94
US7429502B2Sep 30, 2008
Integrated circuit device incorporating metallurgical bond to enhance thermal conduction to a heat sink
AGERE SYSTEMS INC23 citations91
US7328830B2Feb 12, 2008
Structure and method for bonding to copper interconnect structures
AGERE SYSTEMS INC22 citations91
US7301231B2Nov 27, 2007
Reinforced bond pad for a semiconductor device
AGERE SYSTEMS INC31 citations89
US6960836B2Nov 1, 2005
Reinforced bond pad
AGERE SYSTEMS INC13 citations83
US7777333B2Aug 17, 2010
Structure and method for fabricating flip chip devices
AGERE SYSTEMS INC9 citations82
US7327029B2Feb 5, 2008
Integrated circuit device incorporating metallurigical bond to enhance thermal conduction to a heat sink
AGERE SYSTEMS INC3 citations61
US7221173B2May 22, 2007
Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process
AGERE SYSTEMS INC6 citations61