Inventor
KONDO ICHIHARU
JP10 patents
⚠️ This page may combine multiple inventors who share the name “KONDO ICHIHARU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NIPPON DENSO CO
5 patentsUS5656858AAug 12, 1997
Semiconductor device with bump structure
NIPPON DENSO CO279 citations98
US5635764AJun 3, 1997
Surface treated structure for solder joint
NIPPON DENSO CO32 citations92
US5360765ANov 1, 1994
Method of forming electrodes of semiconductor device
NIPPON DENSO CO20 citations92
US5876861AMar 2, 1999
Sputter-deposited nickel layer
NIPPON DENSO CO9 citations73
US5614291AMar 25, 1997
Semiconductor device and method of manufacturing the same
NIPPON DENSO CO9 citations68
DENSO CORP
5 patentsUS6548386B1Apr 15, 2003
Method for forming and patterning film
DENSO CORP19 citations89
US7030496B2Apr 18, 2006
Semiconductor device having aluminum and metal electrodes and method for manufacturing the same
DENSO CORP13 citations80
US7176541B2Feb 13, 2007
Pressure sensor
DENSO CORP7 citations73
US7242065B2Jul 10, 2007
Compact pressure sensor with high corrosion resistance and high accuracy
DENSO CORP3 citations62
US7168326B2Jan 30, 2007
Compact pressure sensor with high corrosion resistance and high accuracy
DENSO CORP4 citations62