Inventor
CHIU SUNG-CHENG
TW3 patents
Patents
3 patentsUS7364998B2Apr 29, 2008
Method for forming high reliability bump structure
TAIWAN SEMICONDUCTOR MFG38 citations92
US7456090B2Nov 25, 2008
Method to reduce UBM undercut
TAIWAN SEMICONDUCTOR MFG11 citations79
US6811955B2Nov 2, 2004
Method for photoresist development with improved CD
TAIWAN SEMICONDUCTOR MFG8 citations69