Inventor · disambiguated record

Yasushige Sakamoto

Also filed as: SAKAMOTO YASUSHIGE

1 granted patent·4 citations·filing 2010–2010

25Inventor score

Technology areasH10W

Files withKITAZAWA TAKASHI1

Top patents by PatentIndex Score

1 record

0164US8692370B2Semiconductor device with copper wire ball-bonded to electrode pad including buffer layerKITAZAWA TAKASHI·Filed 2010·Granted Apr 8, 2014·4 cites·4 claims

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