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Inventor
WONG FEI YING
HK
7 patents
⚠️ This page may combine multiple inventors who share the name “WONG FEI YING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FREESCALE SEMICONDUCTOR INC
3 patents
US6838751B2
Jan 4, 2005
Multi-row leadframe
FREESCALE SEMICONDUCTOR INC
34 citations
90
US7301225B2
Nov 27, 2007
Multi-row lead frame
FREESCALE SEMICONDUCTOR INC
20 citations
89
US7262494B2
Aug 28, 2007
Three-dimensional package
FREESCALE SEMICONDUCTOR INC
7 citations
71
Nexperia BV
2 patents
US12297069B2
May 13, 2025
Electronic component packing reel
Nexperia BV
0 citations
53
US10056343B2
Aug 21, 2018
Packaged semiconductor device with interior polygonal pads
Nexperia BV
0 citations
45
GROENHUIS ROELF ANCO JACOB
1 patent
US9418919B2
Aug 16, 2016
Leadless chip carrier having improved mountability
GROENHUIS ROELF ANCO JACOB
8 citations
76
NXP BV
1 patent
US9269690B2
Feb 23, 2016
Packaged semiconductor device with interior polygonal pads
NXP BV
3 citations
65