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Inventor
HO WAI KEUNG
HK
8 patents
⚠️ This page may combine multiple inventors who share the name “HO WAI KEUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FREESCALE SEMICONDUCTOR INC
3 patents
US7301225B2
Nov 27, 2007
Multi-row lead frame
FREESCALE SEMICONDUCTOR INC
20 citations
89
US6958261B2
Oct 25, 2005
Optical sensor package
FREESCALE SEMICONDUCTOR INC
11 citations
71
US6875635B2
Apr 5, 2005
Method of attaching a die to a substrate
FREESCALE SEMICONDUCTOR INC
4 citations
60
MOTOROLA INC
2 patents
US6667543B1
Dec 23, 2003
Optical sensor package
MOTOROLA INC
83 citations
95
US6798074B2
Sep 28, 2004
Method of attaching a die to a substrate
MOTOROLA INC
2 citations
60
Nexperia BV
2 patents
US9847283B1
Dec 19, 2017
Semiconductor device with wettable corner leads
Nexperia BV
6 citations
66
US11990394B2
May 21, 2024
Semiconductor package and a method for manufacturing of a semiconductor package
Nexperia BV
0 citations
58
THOMSON MULTIMEDIA SA
1 patent
US5793123A
Aug 11, 1998
Electronic device with two power supply modes
THOMSON MULTIMEDIA SA
21 citations
86