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Inventor
SVIEDRYS PAUL C
US
2 patents
Patents
2 patents
US5473813A
Dec 12, 1995
Methods of forming electronic multi-layer printed circuit boards and/or cards and electronic packages including said boards or cards
IBM
46 citations
92
US5363280A
Nov 8, 1994
Printed circuit board or card thermal mass design
IBM
87 citations
92