Inventor
YOSHIDA IKUO
JP36 patents
⚠️ This page may combine multiple inventors who share the name “YOSHIDA IKUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
16 patentsUS6208525B1Mar 27, 2001
Process for mounting electronic device and semiconductor device
HITACHI LTD270 citations98
US6433412B2Aug 13, 2002
Semiconductor device and a method of manufacturing the same
HITACHI LTD92 citations97
US5188280AFeb 23, 1993
Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals
HITACHI LTD114 citations96
US6780677B2Aug 24, 2004
Process for mounting electronic device and semiconductor device
HITACHI LTD43 citations95
US5090609AFeb 25, 1992
Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals
HITACHI LTD98 citations95
US6492737B1Dec 10, 2002
Electronic device and a method of manufacturing the same
HITACHI LTD73 citations94
US6737741B2May 18, 2004
Process for mounting electronic device and semiconductor device
HITACHI LTD13 citations92
US6727583B2Apr 27, 2004
Semiconductor device
HITACHI LTD13 citations92
US6528343B1Mar 4, 2003
Semiconductor device its manufacturing method and electronic device
HITACHI LTD24 citations92
US6461896B1Oct 8, 2002
Process for mounting electronic device and semiconductor device
HITACHI LTD27 citations92
US5885852AMar 23, 1999
Packaged semiconductor device having a flange at its side surface and its manufacturing method
HITACHI LTD25 citations90
US7057278B2Jun 6, 2006
Semiconductor device
HITACHI LTD9 citations74
US6800945B2Oct 5, 2004
Multi-chip semiconductor device with specific chip arrangement
HITACHI LTD8 citations74
US6714383B2Mar 30, 2004
Magnetic disk apparatus
HITACHI LTD10 citations74
US6646350B2Nov 11, 2003
Semiconductor device
HITACHI LTD11 citations74
US6489181B2Dec 3, 2002
Method of manufacturing a semiconductor device
HITACHI LTD12 citations72
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD
6 patentsUS6971161B1Dec 6, 2005
Method for generating component mounting data and component mounting method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD61 citations95
US6996440B2Feb 7, 2006
Method for optimization of an order of component mounting, apparatus using the same, and mounter
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD35 citations92
US6842974B1Jan 18, 2005
Component mounting method and component mounting apparatus
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD39 citations92
US7395129B2Jul 1, 2008
Method for optimization of an order of component mounting, apparatus using the same, and mounter
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD21 citations91
US7313859B2Jan 1, 2008
Method for optimizing placement order by placement apparatuses that place electronic components on circuit board
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD5 citations62
US7133731B2Nov 7, 2006
Component mounting sequence optimizing method, component mounting device, program for executing component mounting sequence optimizing method, and recording medium in which the program is recorded
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4 citations62
PANASONIC CORP
5 patentsUS8019455B2Sep 13, 2011
Component mounting order deciding method and component mounting order deciding apparatus
PANASONIC CORP19 citations84
US7603193B2Oct 13, 2009
Method for optimization of an order for component mounting and apparatus for optimization of an order for component mounting
PANASONIC CORP9 citations83
US7571539B2Aug 11, 2009
Component verification method and apparatus
PANASONIC CORP10 citations83
US7664554B2Feb 16, 2010
Line balance control method, line balance control apparatus, and component mounting machine
PANASONIC CORP3 citations63
US8344558B2Jan 1, 2013
Production system power supply control method, and production system
PANASONIC CORP1 citations47
RENESAS TECH CORP
2 patentsROHM CO LTD
2 patentsUS6635512B1Oct 21, 2003
Method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips
ROHM CO LTD9 citations74
US7226336B2Jun 5, 2007
Method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips
ROHM CO LTD4 citations63