Inventor · disambiguated record

Seung Ho Ann

Also filed as: ANN SEUNG HO

1 granted patent·26 citations·filing 1997–1997

42Inventor score

Technology areasH10W

Files withSAMSUNG ELECTRONICS CO LTD1

Top patents by PatentIndex Score

1 record

0157US5923957AProcess for manufacturing a lead-on-chip semiconductor device package having a discontinuous adhesive layer formed from liquid adhesiveSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Jul 13, 1999·26 cites·10 claims

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