P

Inventor

CABLAO PHILIP LYNDON

SG11 patents
⚠️ This page may combine multiple inventors who share the name “CABLAO PHILIP LYNDON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STATS CHIPPAC LTD

6 patents
US7518226B2Apr 14, 2009

Integrated circuit packaging system with interposer

STATS CHIPPAC LTD78 citations95
US8344495B2Jan 1, 2013

Integrated circuit packaging system with interconnect and method of manufacture thereof

STATS CHIPPAC LTD9 citations83
US8026129B2Sep 27, 2011

Stacked integrated circuits package system with passive components

STATS CHIPPAC LTD16 citations82
US7911046B2Mar 22, 2011

Integrated circuit packaging system with interposer

STATS CHIPPAC LTD9 citations82
US7439620B2Oct 21, 2008

Integrated circuit package-in-package system

STATS CHIPPAC LTD2 citations62
US7759169B2Jul 20, 2010

Integrated circuit heat spreader stacking method

STATS CHIPPAC LTD1 citations51

FILOTEO JR DARIO S

2 patents
US8138080B2Mar 20, 2012

Integrated circuit package system having interconnect stack and external interconnect

FILOTEO JR DARIO S4 citations57
US8421221B2Apr 16, 2013

Integrated circuit heat spreader stacking system

FILOTEO JR DARIO S0 citations48

ESPIRITU EMMANUEL

1 patent
US8395254B2Mar 12, 2013

Integrated circuit package system with heatspreader

ESPIRITU EMMANUEL9 citations81

BATHAN HENRY DESCALZO

1 patent
US8569872B2Oct 29, 2013

Integrated circuit package system with lead-frame paddle scheme for single axis partial saw isolation

BATHAN HENRY DESCALZO0 citations52

CAMACHO ZIGMUND RAMIREZ

1 patent
US8304921B2Nov 6, 2012

Integrated circuit packaging system with interconnect and method of manufacture thereof

CAMACHO ZIGMUND RAMIREZ1 citations51