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Inventor

ABINAN RACHEL LAYDA

SG7 patents
⚠️ This page may combine multiple inventors who share the name “ABINAN RACHEL LAYDA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STATS CHIPPAC LTD

3 patents
US7518226B2Apr 14, 2009

Integrated circuit packaging system with interposer

STATS CHIPPAC LTD78 citations95
US8026129B2Sep 27, 2011

Stacked integrated circuits package system with passive components

STATS CHIPPAC LTD16 citations82
US7911046B2Mar 22, 2011

Integrated circuit packaging system with interposer

STATS CHIPPAC LTD9 citations82

ESPIRITU EMMANUEL

1 patent
US8395254B2Mar 12, 2013

Integrated circuit package system with heatspreader

ESPIRITU EMMANUEL9 citations81

FILOTEO JR DARIO S

1 patent
US8138080B2Mar 20, 2012

Integrated circuit package system having interconnect stack and external interconnect

FILOTEO JR DARIO S4 citations57

BATHAN HENRY DESCALZO

1 patent
US8802555B2Aug 12, 2014

Integrated circuit packaging system with interconnects and method of manufacture thereof

BATHAN HENRY DESCALZO1 citations51

SHIM IL KWON

1 patent
US9000579B2Apr 7, 2015

Integrated circuit package system with bonding in via

SHIM IL KWON0 citations41