Inventor
FILOTEO JR DARIO S
SG27 patents
⚠️ This page may combine multiple inventors who share the name “FILOTEO JR DARIO S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC LTD
14 patentsUS7518226B2Apr 14, 2009
Integrated circuit packaging system with interposer
STATS CHIPPAC LTD78 citations95
US6943057B1Sep 13, 2005
Multichip module package and fabrication method
STATS CHIPPAC LTD68 citations95
US7622325B2Nov 24, 2009
Integrated circuit package system including high-density small footprint system-in-package
STATS CHIPPAC LTD25 citations92
US7298038B2Nov 20, 2007
Integrated circuit package system including die stacking
STATS CHIPPAC LTD39 citations92
US7687892B2Mar 30, 2010
Quad flat package
STATS CHIPPAC LTD14 citations90
US8026129B2Sep 27, 2011
Stacked integrated circuits package system with passive components
STATS CHIPPAC LTD16 citations82
US7911046B2Mar 22, 2011
Integrated circuit packaging system with interposer
STATS CHIPPAC LTD9 citations82
US7619314B2Nov 17, 2009
Integrated circuit package system including die stacking
STATS CHIPPAC LTD7 citations73
US7439620B2Oct 21, 2008
Integrated circuit package-in-package system
STATS CHIPPAC LTD2 citations62
US7659608B2Feb 9, 2010
Stacked die semiconductor device having circuit tape
STATS CHIPPAC LTD4 citations59
US7759169B2Jul 20, 2010
Integrated circuit heat spreader stacking method
STATS CHIPPAC LTD1 citations51
US7928564B2Apr 19, 2011
Multichip module package and fabrication method
STATS CHIPPAC LTD0 citations50
US7445955B2Nov 4, 2008
Multichip module package and fabrication method
STATS CHIPPAC LTD0 citations50
US7786575B2Aug 31, 2010
Stacked die semiconductor device having circuit tape
STATS CHIPPAC LTD1 citations49
ST ASSEMBLY TEST SERVICES LTD
4 patentsUS7008820B2Mar 7, 2006
Chip scale package with open substrate
ST ASSEMBLY TEST SERVICES LTD11 citations83
US7863730B2Jan 4, 2011
Array-molded package heat spreader and fabrication method therefor
ST ASSEMBLY TEST SERVICES LTD5 citations62
US8030783B2Oct 4, 2011
Integrated circuit package with open substrate
ST ASSEMBLY TEST SERVICES LTD2 citations61
US7626277B2Dec 1, 2009
Integrated circuit package with open substrate
ST ASSEMBLY TEST SERVICES LTD0 citations51