Inventor
SHIMOTO TADANORI
JP27 patents
⚠️ This page may combine multiple inventors who share the name “SHIMOTO TADANORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC CORP
23 patentsUS7338884B2Mar 4, 2008
Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device
NEC CORP286 citations99
US7397000B2Jul 8, 2008
Wiring board and semiconductor package using the same
NEC CORP54 citations96
US6861757B2Mar 1, 2005
Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device
NEC CORP55 citations96
US6278153B1Aug 21, 2001
Thin film capacitor formed in via
NEC CORP62 citations96
US5830563ANov 3, 1998
Interconnection structures and method of making same
NEC CORP85 citations96
US5483101AJan 9, 1996
Multilayer printed circuit board
NEC CORP53 citations96
US5712506AJan 27, 1998
Semiconductor device with passivation layer of benzocyclobutene polymer and silicon powder
NEC CORP18 citations93
US5287208AFeb 15, 1994
Liquid crystal device with benzocyclobutene alignment layer and protective coating for electrodes
NEC CORP44 citations93
US7566834B2Jul 28, 2009
Wiring board and semiconductor package using the same
NEC CORP17 citations92
US7474538B2Jan 6, 2009
Semiconductor device mounting board, method of manufacturing the same, method of inspecting the same, and semiconductor package
NEC CORP22 citations92
US7294393B2Nov 13, 2007
Sheet material and wiring board
NEC CORP22 citations92
US6841862B2Jan 11, 2005
Semiconductor package board using a metal base
NEC CORP33 citations92
US6798070B2Sep 28, 2004
Electronic device assembly and a method of connecting electronic devices constituting the same
NEC CORP23 citations92
US6576499B2Jun 10, 2003
Electronic device assembly and a method of connecting electronic devices constituting the same
NEC CORP25 citations92
US7696007B2Apr 13, 2010
Semiconductor package board using a metal base
NEC CORP8 citations84
US6204565B1Mar 20, 2001
Semiconductor carrier and method for manufacturing the same
NEC CORP13 citations74
US6156414ADec 5, 2000
Carrier film and process for producing the same
NEC CORP9 citations74
US6150074ANov 21, 2000
Method of forming electrically conductive wiring pattern
NEC CORP9 citations74
US5889233AMar 30, 1999
Multilayer wiring structure
NEC CORP14 citations74
US7585699B2Sep 8, 2009
Semiconductor package board using a metal base
NEC CORP2 citations63
US7816782B2Oct 19, 2010
Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package
NEC CORP4 citations62
US6444403B1Sep 3, 2002
Resin laminated wiring sheet, wiring structure using the same, and production method thereof
NEC CORP2 citations62
US6333136B1Dec 25, 2001
Carrier film and process for producing the same
NEC CORP0 citations52
NEC ELECTRONICS CORP
3 patentsUS7060604B2Jun 13, 2006
Multilayer wiring substrate, and method of producing same
NEC ELECTRONICS CORP21 citations92
US7745736B2Jun 29, 2010
Interconnecting substrate and semiconductor device
NEC ELECTRONICS CORP15 citations84
US7233066B2Jun 19, 2007
Multilayer wiring substrate, and method of producing same
NEC ELECTRONICS CORP8 citations73