Inventor
HONDA HIROKAZU
JP34 patents
⚠️ This page may combine multiple inventors who share the name “HONDA HIROKAZU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC ELECTRONICS CORP
13 patentsUS7728440B2Jun 1, 2010
Warp-suppressed semiconductor device
NEC ELECTRONICS CORP47 citations98
US7217999B1May 15, 2007
Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semiconductor chip on the interconnection board
NEC ELECTRONICS CORP46 citations96
US6611063B1Aug 26, 2003
Resin-encapsulated semiconductor device
NEC ELECTRONICS CORP89 citations93
US7060604B2Jun 13, 2006
Multilayer wiring substrate, and method of producing same
NEC ELECTRONICS CORP21 citations92
US6734566B2May 11, 2004
Recyclable flip-chip semiconductor device
NEC ELECTRONICS CORP28 citations92
US6696764B2Feb 24, 2004
Flip chip type semiconductor device and method of manufacturing the same
NEC ELECTRONICS CORP50 citations92
US7138064B2Nov 21, 2006
Semiconductor device and method of manufacturing the same
NEC ELECTRONICS CORP17 citations84
US7074650B2Jul 11, 2006
Flip-chip type semiconductor device and method of manufacturing the same
NEC ELECTRONICS CORP15 citations84
US6767761B2Jul 27, 2004
Method of manufacturing a flip-chip semiconductor device with a stress-absorbing layer made of thermosetting resin
NEC ELECTRONICS CORP7 citations74
US6696317B1Feb 24, 2004
Method of manufacturing a flip-chip semiconductor device with a stress-absorbing layer made of thermosetting resin
NEC ELECTRONICS CORP11 citations74
US7233066B2Jun 19, 2007
Multilayer wiring substrate, and method of producing same
NEC ELECTRONICS CORP8 citations73
US7674989B2Mar 9, 2010
Wiring board and method for manufacturing the same
NEC ELECTRONICS CORP2 citations62
US7498249B2Mar 3, 2009
Method of forming a connecting conductor and wirings of a semiconductor chip
NEC ELECTRONICS CORP6 citations57
NEC CORP
9 patentsUS6406942B2Jun 18, 2002
Flip chip type semiconductor device and method for manufacturing the same
NEC CORP154 citations99
US7397000B2Jul 8, 2008
Wiring board and semiconductor package using the same
NEC CORP54 citations96
US7566834B2Jul 28, 2009
Wiring board and semiconductor package using the same
NEC CORP17 citations92
US6445062B1Sep 3, 2002
Semiconductor device having a flip chip cavity with lower stress and method for forming same
NEC CORP40 citations92
US6723627B1Apr 20, 2004
Method for manufacturing semiconductor devices
NEC CORP42 citations89
US7838779B2Nov 23, 2010
Wiring board, method for manufacturing same, and semiconductor package
NEC CORP16 citations84
US7348673B2Mar 25, 2008
Semiconductor device
NEC CORP13 citations84
US5704593AJan 6, 1998
Film carrier tape for semiconductor package and semiconductor device employing the same
NEC CORP10 citations74
US7816782B2Oct 19, 2010
Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package
NEC CORP4 citations62
RENESAS ELECTRONICS CORP
5 patentsUS8008130B2Aug 30, 2011
Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semicondutor chip on the interconnection board
RENESAS ELECTRONICS CORP26 citations92
US7911038B2Mar 22, 2011
Wiring board, semiconductor device using wiring board and their manufacturing methods
RENESAS ELECTRONICS CORP7 citations84
US9117814B2Aug 25, 2015
Semiconductor device
RENESAS ELECTRONICS CORP4 citations73
US10098179B2Oct 9, 2018
Electronic device
RENESAS ELECTRONICS CORP4 citations72
US9362262B2Jun 7, 2016
Semiconductor device
RENESAS ELECTRONICS CORP1 citations52