Inventor

HUANG ELBERT

US36 patents

⚠️ This page may combine multiple inventors who share the name “HUANG ELBERT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUANG ELBERT

IBM

Self-forming barrier for use in air gap formation

Nonlithographic method to produce self-aligned mask, articles produced by same and compositions for same

Closed air gap interconnect structure

Nonlithographic method to produce masks by selective reaction, articles produced, and composition for same

Air gap and air spacer pinch off

Method of forming closed air gap interconnects and structures formed thereby

Method of forming closed air gap interconnects and structures formed thereby

Air gap and air spacer pinch off

Air gap and air spacer pinch off

Air-dielectric for subtractive etch line and via metallization

Method for producing self-aligned mask, articles produced by same and composition for same

Antireflective hardmask and uses thereof

Nonlithographic method to produce self-aligned mask, articles produced by same and compositions for same

Metal silicate spacers for fully aligned vias

Selective blocking boundary placement for circuit locations requiring electromigration short-length

Antireflective hardmask and uses thereof

Nonlithographic method to produce masks by selective reaction, articles produced, and composition for same

Method for fabricating interconnect structures with reduced plasma damage

Air gap and air spacer pinch off

Air gap and air spacer pinch off

Metal silicate spacers for fully aligned vias

Air gap and air spacer pinch off

Selective blocking boundary placement for circuit locations requiring electromigration short-length

Strengthening of a structure by infiltration

ADEIA SEMICONDUCTOR SOLUTIONS LLC

Selective recessing to form a fully aligned via

Self-forming barrier for use in air gap formation

Selective recessing to form a fully aligned via

ARNOLD JOHN C

Methods to mitigate plasma damage in organosilicate dielectrics

Methods to mitigate plasma damage in organosilicate dielectrics

COLBURN MATTHEW E

Selectively coated self-aligned mask

Interconnect structures with ternary patterned features generated from two lithographic processes

SRIVASTAVA RAVI PRAKASH

Methods and structures to enable self-aligned via etch for Cu damascene structure using trench first metal hard mask (TFMHM) scheme

HORAK DAVID V

Air-dielectric for subtractive etch line and via metallization

TESSERA LLC

Self-forming barrier for use in air gap formation

TESSERA INC

Self-forming barrier for use in air gap formation

BRUNNER TIMOTHY A

Method for producing self-aligned mask, articles produced by same and composition for same