Inventor

PFEIFFER DIRK

US105 patents

⚠️ This page may combine multiple inventors who share the name “PFEIFFER DIRK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PFEIFFER DIRK

IBM

Antireflective SiO-containing compositions for hardmask layer

Recovery of hydrophobicity of low-k and ultra low-k organosilicate films used as inter metal dielectrics

Photoresist composition

Wafer scale epitaxial graphene transfer

Graphene resistor based tamper resistant identifier with contactless reading

Reliable physical unclonable function for device authentication

Physical unclonable function generation and management

Reactive material for integrated circuit tamper detection and response

Antireflective film-forming composition, method for manufacturing the same, and antireflective film and pattern formation method using the same

Molecular photoresists containing nonpolymeric silsesquioxanes

Patterning layers comprised of spin-on ceramic films

Method for fabricating dual damascence structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascence patterning

Techniques for patterning features in semiconductor devices

Silicon-containing compositions for spin-on ARC/hardmask materials

Encryption engine with an undetectable/tamper-proof private key in late node CMOS technology

Carbon nanotube array for cryptographic key generation and protection

Physical unclonable function generation and management

Integrated circuit tamper detection and response

Multi-doped silicon antifuse device for integrated circuit

Carbon nanostructure device fabrication utilizing protect layers

Authentication using graphene based devices as physical unclonable functions

Method for fabricating dual damascene structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascene patterning

Recovery of hydrophobicity of low-k and ultra low-k organosilicate films used as inter metal dielectrics

Antireflective composition and process of making a lithographic structure

Lithographic antireflective hardmask compositions and uses thereof

Method for image reversal of implant resist using a single photolithography exposure and structures formed thereby

Graded spin-on organic antireflective coating for photolithography

Antireflective hardmask and uses thereof

Method for fabricating dual damascene structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascene patterning

Method and system for tone inverting of residual layer tolerant imprint lithography

Reflective film interface to restore transverse magnetic wave contrast in lithographic processing

Reflective film interface to restore transverse magnetic wave contrast in lithographic processing

Method of forming a ceramic diffusion barrier layer

Polycarbosilane buried etch stops in interconnect structures

Etch selectivity enhancement for tunable etch resistant anti-reflective layer

Interconnect structures incorporating low-k dielectric barrier films

Patterning layers comprised of spin-on ceramic films

Tamper-resistant circuit, back-end of the line memory and physical unclonable function for supply chain protection

RRAM filament location based on NIR emission

Method for product authentication using a microfluidic reader

EDELSTEIN DANIEL C

Reliable physical unclonable function for device authentication

Structure with sub-lithographic random conductors as a physical unclonable function

BONILLA GRISELDA

Graphene cap for copper interconnect structures

Method of forming a graphene cap for copper interconnect structures

BRULEY JOHN

Reliable physical unclonable function for device authentication

GLOBALFOUNDRIES US 2 LLC

Physical unclonable function generation and management

SAMSUNG ELECTRONICS CO LTD

Method of forming a graphene cap for copper interconnect structures

SHINETSU CHEMICAL CO

Sacrificial film-forming composition, patterning process, sacrificial film and removal method

BRUCE ROBERT L

Interconnect structure and method for fabricating on-chip interconnect structures by image reversal

GOLDFARB DARIO L

Molecular spacer layer for semiconductor oxide surface and high-K dielectric stack