Inventor
GLUSCHENKOV OLEG
US230 patents
⚠️ This page may combine multiple inventors who share the name “GLUSCHENKOV OLEG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
44 patentsUS6977194B2Dec 20, 2005
Structure and method to improve channel mobility by gate electrode stress modification
IBM225 citations99
US9799736B1Oct 24, 2017
High acceptor level doping in silicon germanium
IBM420 citations98
US6720630B2Apr 13, 2004
Structure and method for MOSFET with metallic gate electrode
IBM122 citations98
US7247547B2Jul 24, 2007
Method of fabricating a field effect transistor having improved junctions
IBM57 citations96
US7138685B2Nov 21, 2006
Vertical MOSFET SRAM cell
IBM54 citations96
US7002209B2Feb 21, 2006
MOSFET structure with high mechanical stress in the channel
IBM61 citations96
US9773901B1Sep 26, 2017
Bottom spacer formation for vertical transistor
IBM43 citations94
US6930060B2Aug 16, 2005
Method for forming a uniform distribution of nitrogen in silicon oxynitride gate dielectric
IBM90 citations94
US9748382B1Aug 29, 2017
Self aligned top extension formation for vertical transistors
IBM13 citations93
US7394273B2Jul 1, 2008
On-chip electromigration monitoring system
IBM31 citations93
US7262087B2Aug 28, 2007
Dual stressed SOI substrates
IBM20 citations93
US7176116B2Feb 13, 2007
High performance FET with laterally thin extension
IBM17 citations93
US7084024B2Aug 1, 2006
Gate electrode forming methods using conductive hard mask
IBM40 citations93
US7026247B2Apr 11, 2006
Nanocircuit and self-correcting etching method for fabricating same
IBM21 citations93
US7023064B2Apr 4, 2006
Temperature stable metal nitride gate electrode
IBM32 citations93
US6982196B2Jan 3, 2006
Oxidation method for altering a film structure and CMOS transistor structure formed therewith
IBM27 citations93
US6806534B2Oct 19, 2004
Damascene method for improved MOS transistor
IBM35 citations93
US6544874B2Apr 8, 2003
Method for forming junction on insulator (JOI) structure
IBM48 citations93
US6509221B1Jan 21, 2003
Method for forming high performance CMOS devices with elevated sidewall spacers
IBM25 citations93
US9613870B2Apr 4, 2017
Gate stack formed with interrupted deposition processes and laser annealing
IBM13 citations92
US9613866B2Apr 4, 2017
Gate stack formed with interrupted deposition processes and laser annealing
IBM11 citations92
US9455185B1Sep 27, 2016
Laser anneal of buried metallic interconnects including through silicon vias
IBM16 citations92
US9449921B1Sep 20, 2016
Voidless contact metal structures
IBM17 citations92
US7585704B2Sep 8, 2009
Method of producing highly strained PECVD silicon nitride thin films at low temperature
IBM28 citations92
US7504700B2Mar 17, 2009
Method of forming an ultra-thin [[HfSiO]] metal silicate film for high performance CMOS applications and semiconductor structure formed in said method
IBM26 citations92
US7030012B2Apr 18, 2006
Method for manufacturing tungsten/polysilicon word line structure in vertical DRAM
IBM49 citations92
US6911384B2Jun 28, 2005
Gate structure with independently tailored vertical doping profile
IBM22 citations92
US6890833B2May 10, 2005
Trench isolation employing a doped oxide trench fill
IBM25 citations92
US6746933B1Jun 8, 2004
Pitcher-shaped active area for field effect transistor and method of forming same
IBM35 citations92
US6709926B2Mar 23, 2004
High performance logic and high density embedded dram with borderless contact and antispacer
IBM26 citations92
US6686637B1Feb 3, 2004
Gate structure with independently tailored vertical doping profile
IBM29 citations92
US6566210B2May 20, 2003
Method of improving gate activation by employing atomic oxygen enhanced oxidation
IBM35 citations92
US6451662B1Sep 17, 2002
Method of forming low-leakage on-chip capacitor
IBM47 citations92
US6444516B1Sep 3, 2002
Semi-insulating diffusion barrier for low-resistivity gate conductors
IBM31 citations92
US7160771B2Jan 9, 2007
Forming gate oxides having multiple thicknesses
IBM20 citations88
US6838334B1Jan 4, 2005
Method of fabricating a buried collar
IBM21 citations88
US10777468B1Sep 15, 2020
Stacked vertical field-effect transistors with sacrificial layer patterning
IBM14 citations86
US10692768B1Jun 23, 2020
Vertical transport field-effect transistor architecture
IBM13 citations86
US10658180B1May 19, 2020
EUV pattern transfer with ion implantation and reduced impact of resist residue
IBM6 citations84
US10079299B2Sep 18, 2018
Self aligned top extension formation for vertical transistors
IBM8 citations84
US9978750B1May 22, 2018
Low resistance source/drain contacts for complementary metal oxide semiconductor (CMOS) devices
IBM11 citations84
US9972682B2May 15, 2018
Low resistance source drain contact formation
IBM13 citations84
US9954103B1Apr 24, 2018
Bottom spacer formation for vertical transistor
IBM11 citations84
US9941391B2Apr 10, 2018
Method of forming vertical transistor having dual bottom spacers
IBM8 citations84
INFINEON TECHNOLOGIES AG
3 patentsUS6576565B1Jun 10, 2003
RTCVD process and reactor for improved conformality and step-coverage
INFINEON TECHNOLOGIES AG19 citations89
US6261972B1Jul 17, 2001
Dual gate oxide process for uniform oxide thickness
INFINEON TECHNOLOGIES AG27 citations89
US6358867B1Mar 19, 2002
Orientation independent oxidation of silicon
INFINEON TECHNOLOGIES AG45 citations88
LIU YAOCHENG
2 patentsGLUSCHENKOV OLEG
1 patentShowing the top 50 of 230 patents by PatentIndex Score.