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Inventor

STERRETT TERRY LEE

US5 patents
⚠️ This page may combine multiple inventors who share the name “STERRETT TERRY LEE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

3 patents
US7387827B2Jun 17, 2008

Interconnection designs and materials having improved strength and fatigue life

INTEL CORP9 citations81
US7521115B2Apr 21, 2009

Low temperature bumping process

INTEL CORP4 citations61
US7718216B2May 18, 2010

Low temperature bumping process

INTEL CORP0 citations51

STERRETT TERRY LEE

1 patent
US8642462B2Feb 4, 2014

Interconnection designs and materials having improved strength and fatigue life

STERRETT TERRY LEE3 citations54

MICRON TECHNOLOGY INC

1 patent
US9136239B2Sep 15, 2015

Interconnection designs and materials having improved strength and fatigue life

MICRON TECHNOLOGY INC0 citations49