Inventor
KIM JIN-HEUNG
KR7 patents
⚠️ This page may combine multiple inventors who share the name “KIM JIN-HEUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
5 patentsUS6039830AMar 21, 2000
Method of and apparatus for laminating a semiconductor wafer with protective tape
SAMSUNG ELECTRONICS CO LTD39 citations90
US6193586B1Feb 27, 2001
Method and apparatus for grinding wafers using a grind chuck having high elastic modulus
SAMSUNG ELECTRONICS CO LTD35 citations88
US6629876B1Oct 7, 2003
Apparatus for grinding wafers using a grind chuck having a high elastic modulus
SAMSUNG ELECTRONICS CO LTD11 citations69
US6269281B1Jul 31, 2001
Back lapping in-line system for semiconductor device fabrication
SAMSUNG ELECTRONICS CO LTD0 citations48
US10725560B2Jul 28, 2020
Electronic device and method controlling accessory
SAMSUNG ELECTRONICS CO LTD0 citations45