Inventor
OSADA SHOICHI
JP29 patents
⚠️ This page may combine multiple inventors who share the name “OSADA SHOICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINETSU CHEMICAL CO
24 patentsUS6630745B1Oct 7, 2003
Semiconductor encapsulating epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO18 citations92
US6162878ADec 19, 2000
Semiconductor encapsulating epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO21 citations92
US8022137B2Sep 20, 2011
Silicone resin composition for optical semiconductor devices
SHINETSU CHEMICAL CO9 citations84
US7095125B2Aug 22, 2006
Semiconductor encapsulating epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO15 citations84
US6297306B1Oct 2, 2001
Semiconductor encapsulating epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO15 citations84
US6783859B2Aug 31, 2004
Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO10 citations74
US6518332B2Feb 11, 2003
Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith
SHINETSU CHEMICAL CO9 citations74
US6160078ADec 12, 2000
Semiconductor encapsulating epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO10 citations74
US7122587B2Oct 17, 2006
Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO10 citations72
US7999016B2Aug 16, 2011
Semiconductor encapsulating epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO2 citations63
US6291556B1Sep 18, 2001
Semiconductor encapsulating epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO5 citations63
US7969027B2Jun 28, 2011
Semiconductor device encapsulated with resin composition
SHINETSU CHEMICAL CO3 citations62
US7511383B2Mar 31, 2009
Flame retardant and an epoxy resin composition comprising the same for encapsulating semiconductor devices
SHINETSU CHEMICAL CO2 citations62
US12305036B2May 20, 2025
Epoxy resin composition for semiconductor encapsulation and semiconductor device
SHINETSU CHEMICAL CO1 citations60
US11639410B2May 2, 2023
Heat-curable resin composition and uses thereof
SHINETSU CHEMICAL CO0 citations55
US8796375B2Aug 5, 2014
Prepreg, metal-clad laminate, printed wiring board, and semiconductor device
SHINETSU CHEMICAL CO0 citations52
US7898094B2Mar 1, 2011
Epoxy resin composition for encapsulating semiconductor devices and semiconductor devices encapsulated therewith
SHINETSU CHEMICAL CO0 citations52
US6894091B2May 17, 2005
Semiconductor encapsulating epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO1 citations52
US11028269B2Jun 8, 2021
Silicone-modified epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO0 citations50
US10851261B2Dec 1, 2020
Semiconductor-encapsulating epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO0 citations50
US10676635B2Jun 9, 2020
Silicone-modified epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO0 citations50
US9633921B2Apr 25, 2017
Semiconductor encapsulation resin composition and semiconductor device comprised of cured product of the semiconductor encapsulation resin composition
SHINETSU CHEMICAL CO1 citations50
US7910638B2Mar 22, 2011
Semiconductor-encapsulating epoxy resin composition, preparation method, and semiconductor device
SHINETSU CHEMICAL CO1 citations48
US8048969B2Nov 1, 2011
Semiconductor encapsulating epoxy resin composition and semiconductor device
SHINETSU CHEMICAL CO0 citations42