Inventor

LEE DOO-HWAN

KR84 patents

⚠️ This page may combine multiple inventors who share the name “LEE DOO-HWAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE DOO-HWAN

SAMSUNG ELECTRO MECH

Printed circuit board including embedded chips and method of fabricating the same using plating

Printed circuit board and manufacturing method thereof

Method of manufacturing a component-embedded PCB

Printed circuit board having embedded electronic components and manufacturing method thereof

Electronic component embedded substrate and manufacturing method thereof

Printed circuit board including embedded chips and method of fabricating the same

Multilayered substrate and method of manufacturing the same

Substrate having embedded interconnect structure

Fan-out semiconductor package

Circuit board and method of manufacturing the same

Electronic component and method of manufacturing the same

Printed circuit board including electronic component embedded therein and method for manufacturing the same

Substrate embedding passive element

Printed circuit board with weak magnetic field sensor

Fan-out semiconductor package

Electronic component package and method of manufacturing the same

Fan-out semiconductor package

Fan-out semiconductor package

Electronic component embedded substrate and method for manufacturing electronic component embedded substrate

Method for manufacturing a printed circuit board including an embedded electronic component

Method of manufacturing a component-embedded printed circuit board

Printed circuit board having weak magnetic field sensor and method of manufacturing the same

Printed circuit board

Fan-out semiconductor package

SAMSUNG ELECTRONICS CO LTD

Fan-out semiconductor package

Fan-out semiconductor package

Fan-out semiconductor package

Fan-out semiconductor package

Fan-out semiconductor package and manufacturing method thereof

Fan-out semiconductor package

Network searching by device supporting multiple communication methods

Method for providing communication service and electronic device thereof

Fan-out semiconductor package

Semiconductor package

Semiconductor package

Fan-out semiconductor package

LEE DOO-HWAN

Mesoporous oxide-catalyst complex and method of preparing the mesoporous oxide-catalyst complex

Electro device embedded printed circuit board and manufacturing method thereof

Manufacturing method of printed circuit board having electro component

LEE HYUN-CHUL

Non-pyrophoric catalyst for water-gas shift reaction and method of preparing the same

Fuel processor having movable burner, method of operating the same, and fuel cell system having the same

Methanation catalyst, and carbon monoxide removing system, fuel processor, and fuel cell including the same

LEE SANG CHUL

Embedded printed circuit board and method of manufacturing the same

Embedded printed circuit board and method of manufacturing the same

LEE DOO HWAN

Semiconductor package and method of manufacturing the same

Printed circuit board having electronic component

JEONG JIN-SOO

Method of processing cavity of core substrate

JI SANG-MIN

Porous oxide catalyst and method of preparing the porous oxide catalyst

JEONG TAE SUNG

Embedded ball grid array substrate and manufacturing method thereof

HYUNDAI MOTOR CO LTD

Heat treatment machine having a cooling chamber