P

Inventor

INAGAKI YASUSHI

JP48 patents
⚠️ This page may combine multiple inventors who share the name “INAGAKI YASUSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBIDEN CO LTD

32 patents
US7342803B2Mar 11, 2008

Printed circuit board and method of manufacturing printed circuit board

IBIDEN CO LTD92 citations99
US7307852B2Dec 11, 2007

Printed circuit board and method for manufacturing printed circuit board

IBIDEN CO LTD82 citations99
US6876554B1Apr 5, 2005

Printing wiring board and method of producing the same and capacitor to be contained in printed wiring board

IBIDEN CO LTD160 citations99
US6724638B1Apr 20, 2004

Printed wiring board and method of producing the same

IBIDEN CO LTD249 citations99
US7978478B2Jul 12, 2011

Printed circuit board

IBIDEN CO LTD46 citations98
US7855894B2Dec 21, 2010

Printed circuit board

IBIDEN CO LTD26 citations96
US7995352B2Aug 9, 2011

Printed circuit board

IBIDEN CO LTD11 citations92
US7881069B2Feb 1, 2011

Printed circuit board

IBIDEN CO LTD13 citations92
US7864542B2Jan 4, 2011

Printed circuit board

IBIDEN CO LTD21 citations92
US7864543B2Jan 4, 2011

Printed circuit board

IBIDEN CO LTD9 citations92
US7507913B2Mar 24, 2009

Multilayer printed wiring board

IBIDEN CO LTD24 citations92
US8021748B2Sep 20, 2011

Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing same

IBIDEN CO LTD17 citations84
US7800216B2Sep 21, 2010

Multilayer printed wiring board

IBIDEN CO LTD9 citations84
US9443800B2Sep 13, 2016

Package substrate and method for manufacturing package substrate

IBIDEN CO LTD7 citations83
US9287250B2Mar 15, 2016

Package substrate

IBIDEN CO LTD7 citations83
US9763319B2Sep 12, 2017

Package substrate and method for manufacturing package substrate

IBIDEN CO LTD4 citations72
US9263784B2Feb 16, 2016

Package substrate

IBIDEN CO LTD3 citations72
US9699909B2Jul 4, 2017

Wiring board with built-in electronic component

IBIDEN CO LTD5 citations67
US9716059B2Jul 25, 2017

Package substrate and method for manufacturing package substrate

IBIDEN CO LTD4 citations66
US9060446B2Jun 16, 2015

Printed circuit board

IBIDEN CO LTD1 citations63
US8842440B2Sep 23, 2014

Printed circuit board and method of manufacturing printed circuit board

IBIDEN CO LTD1 citations63
US10134693B2Nov 20, 2018

Printed wiring board

IBIDEN CO LTD1 citations52
US9564392B2Feb 7, 2017

Printed wiring board and semiconductor package

IBIDEN CO LTD1 citations52
US9226397B2Dec 29, 2015

Multilayer printed wiring board having multilayer core substrate

IBIDEN CO LTD0 citations52
US9101054B2Aug 4, 2015

Multilayer printed wiring board

IBIDEN CO LTD0 citations52
US9854669B2Dec 26, 2017

Package substrate

IBIDEN CO LTD0 citations42
US9793241B2Oct 17, 2017

Printed wiring board

IBIDEN CO LTD0 citations42
US9655242B2May 16, 2017

Printed wiring board

IBIDEN CO LTD0 citations42
US9510447B2Nov 29, 2016

Printed wiring board and method for manufacturing the same

IBIDEN CO LTD0 citations42
US9510450B2Nov 29, 2016

Printed wiring board and method for manufacturing the same

IBIDEN CO LTD0 citations42
US9704795B2Jul 11, 2017

Printed wiring board and method for manufacturing the same

IBIDEN CO LTD0 citations41
US9538651B2Jan 3, 2017

Printed wiring board and method for manufacturing the same

IBIDEN CO LTD0 citations41

INAGAKI YASUSHI

13 patents

ALPS ALPINE CO LTD

1 patent

MURATA MANUFACTURING CO

1 patent

ALPS ELECTRIC CO LTD

1 patent