Inventor
HAN MI-JA
KR33 patents
⚠️ This page may combine multiple inventors who share the name “HAN MI-JA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
14 patentsUS9853003B1Dec 26, 2017
Fan-out semiconductor package
SAMSUNG ELECTRO MECH31 citations93
US10842021B1Nov 17, 2020
Printed circuit board
SAMSUNG ELECTRO MECH11 citations85
US10083929B2Sep 25, 2018
Fan-out semiconductor package
SAMSUNG ELECTRO MECH7 citations84
US7764149B2Jul 27, 2010
Electromagnetic bandgap structure and printed circuit board
SAMSUNG ELECTRO MECH18 citations83
US7944320B2May 17, 2011
Electromagnetic bandgap structure and printed circuit board including multi-via
SAMSUNG ELECTRO MECH14 citations79
US8035991B2Oct 11, 2011
Electromagnetic bandgap structure and printed circuit board
SAMSUNG ELECTRO MECH5 citations74
US10304807B2May 28, 2019
Fan-out semiconductor package
SAMSUNG ELECTRO MECH2 citations73
US10217631B2Feb 26, 2019
Fan-out semiconductor package
SAMSUNG ELECTRO MECH2 citations73
US10157886B2Dec 18, 2018
Fan-out semiconductor package
SAMSUNG ELECTRO MECH4 citations73
US9496594B2Nov 15, 2016
Printed circuit board and printed circuit board for camera module
SAMSUNG ELECTRO MECH3 citations73
US7563104B2Jul 21, 2009
Printed circuit board having connectors
SAMSUNG ELECTRO MECH5 citations63
US10475751B2Nov 12, 2019
Fan-out semiconductor package
SAMSUNG ELECTRO MECH0 citations52
US7965521B2Jun 21, 2011
Electromagnetic bandgap structure and printed circuit board
SAMSUNG ELECTRO MECH0 citations52
US11069666B2Jul 20, 2021
Semiconductor package
SAMSUNG ELECTRO MECH0 citations50
KIM HAN
9 patentsUS8164006B2Apr 24, 2012
Electromagnetic bandgap structure and printed circuit board
KIM HAN6 citations83
US8699234B2Apr 15, 2014
EMI noise shield board including electromagnetic bandgap structure
KIM HAN6 citations72
US8598468B2Dec 3, 2013
Electromagnetic bandgap structure and printed circuit board
KIM HAN5 citations72
US8279616B2Oct 2, 2012
Printed circuit board with embedded chip capacitor
KIM HAN4 citations63
US8253025B2Aug 28, 2012
Printed circuit board having electromagnetic bandgap structure
KIM HAN3 citations63
US8258408B2Sep 4, 2012
Electromagnetic interference noise reduction board using electromagnetic bandgap structure
KIM HAN5 citations62
US8212150B2Jul 3, 2012
Electromagnetic interference noise reduction board using electromagnetic bandgap structure
KIM HAN5 citations62
US8422248B2Apr 16, 2013
Electromagnetic bandgap structure and printed circuit board
KIM HAN1 citations52
US8314341B2Nov 20, 2012
Printed circuit board having electromagnetic bandgap structure
KIM HAN1 citations51
SAMSUNG ELECTRONICS CO LTD
4 patentsUS10600679B2Mar 24, 2020
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD3 citations73
US10373884B2Aug 6, 2019
Fan-out semiconductor package for packaging semiconductor chip and capacitors
SAMSUNG ELECTRONICS CO LTD1 citations63
US10923433B2Feb 16, 2021
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US10770403B2Sep 8, 2020
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations62