Inventor
PARK DAE-HYUN
KR46 patents
⚠️ This page may combine multiple inventors who share the name “PARK DAE-HYUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
22 patentsUS9853003B1Dec 26, 2017
Fan-out semiconductor package
SAMSUNG ELECTRO MECH31 citations93
US10256200B2Apr 9, 2019
Electronic component package and method of manufacturing the same
SAMSUNG ELECTRO MECH7 citations84
US10199337B2Feb 5, 2019
Electronic component package and method of manufacturing the same
SAMSUNG ELECTRO MECH9 citations84
US10083929B2Sep 25, 2018
Fan-out semiconductor package
SAMSUNG ELECTRO MECH7 citations84
US9984979B2May 29, 2018
Fan-out semiconductor package and method of manufacturing the same
SAMSUNG ELECTRO MECH10 citations84
US7764149B2Jul 27, 2010
Electromagnetic bandgap structure and printed circuit board
SAMSUNG ELECTRO MECH18 citations83
US8035991B2Oct 11, 2011
Electromagnetic bandgap structure and printed circuit board
SAMSUNG ELECTRO MECH5 citations74
US10304807B2May 28, 2019
Fan-out semiconductor package
SAMSUNG ELECTRO MECH2 citations73
US10262949B2Apr 16, 2019
Fan-out semiconductor package and method of manufacturing the same
SAMSUNG ELECTRO MECH4 citations73
US10217631B2Feb 26, 2019
Fan-out semiconductor package
SAMSUNG ELECTRO MECH2 citations73
US10157886B2Dec 18, 2018
Fan-out semiconductor package
SAMSUNG ELECTRO MECH4 citations73
US10157851B2Dec 18, 2018
Fan-out semiconductor package
SAMSUNG ELECTRO MECH5 citations73
US9496594B2Nov 15, 2016
Printed circuit board and printed circuit board for camera module
SAMSUNG ELECTRO MECH3 citations73
US10333193B2Jun 25, 2019
Printed circuit board and printed circuit board for camera module
SAMSUNG ELECTRO MECH1 citations63
US11037884B2Jun 15, 2021
Semiconductor package having through-hole including shielding wiring structure
SAMSUNG ELECTRO MECH1 citations62
US10553541B2Feb 4, 2020
Fan-out semiconductor package
SAMSUNG ELECTRO MECH0 citations52
US9526164B2Dec 20, 2016
Printed circuit board and manufacturing method thereof
SAMSUNG ELECTRO MECH0 citations52
US9313893B2Apr 12, 2016
Substrate having electronic component embedded therein and method of manufacturing the same
SAMSUNG ELECTRO MECH1 citations52
US7965521B2Jun 21, 2011
Electromagnetic bandgap structure and printed circuit board
SAMSUNG ELECTRO MECH0 citations52
US10667386B2May 26, 2020
Circuit board and conductive pattern structure
SAMSUNG ELECTRO MECH0 citations51
US10251259B2Apr 2, 2019
Circuit board and conductive pattern structure
SAMSUNG ELECTRO MECH0 citations51
US11069666B2Jul 20, 2021
Semiconductor package
SAMSUNG ELECTRO MECH0 citations50
KIM HAN
10 patentsUS8183468B2May 22, 2012
Electromagnetic bandgap structure, printed circuit board comprising this and method thereof
KIM HAN7 citations84
US8699234B2Apr 15, 2014
EMI noise shield board including electromagnetic bandgap structure
KIM HAN6 citations72
US8279616B2Oct 2, 2012
Printed circuit board with embedded chip capacitor
KIM HAN4 citations63
US8253025B2Aug 28, 2012
Printed circuit board having electromagnetic bandgap structure
KIM HAN3 citations63
US8258408B2Sep 4, 2012
Electromagnetic interference noise reduction board using electromagnetic bandgap structure
KIM HAN5 citations62
US8212150B2Jul 3, 2012
Electromagnetic interference noise reduction board using electromagnetic bandgap structure
KIM HAN5 citations62
US8081052B2Dec 20, 2011
Electromagnetic bandgap structure and printed circuit board
KIM HAN4 citations61
US8952265B2Feb 10, 2015
Electromagnetic interference noise reduction package board
KIM HAN2 citations60
US8422248B2Apr 16, 2013
Electromagnetic bandgap structure and printed circuit board
KIM HAN1 citations52
US8289099B2Oct 16, 2012
Electromagnetic bandgap structure and circuit board
KIM HAN0 citations40
PARK DAE-HYUN
3 patentsUS8153907B2Apr 10, 2012
Electromagnetic bandgap structure and printed circuit board
PARK DAE-HYUN6 citations81
US8227704B2Jul 24, 2012
Printed circuit board having electromagnetic bandgap structure
PARK DAE-HYUN4 citations61
US8853560B2Oct 7, 2014
Electromagnetic bandgap structure and printed circuit board
PARK DAE-HYUN0 citations49