Inventor

ARITA KIYOSHI

JP48 patents

⚠️ This page may combine multiple inventors who share the name “ARITA KIYOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ARITA KIYOSHI

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Method of cutting semiconductor wafer and protective sheet used in the cutting method

Method for surface treatment of silicon based substrate

Plasma processing apparatus and method

Method of manufacturing semiconductor device and cutting apparatus for cutting semiconductor wafer

Method of manufacturing semiconductor device, plasma processing apparatus and plasma processing method

Plasma treatment apparatus and method

Apparatus and method for plasma etching

Plasma processing apparatus and plasma processing method

Method of forming inner lead bonding on a microchip

Plasma processing method

Plasma process apparatus and plasma process method for substrate

Method for wire bonding

Inner lead bonding apparatus

Plasma treating apparatus and plasma treating method

Method of and apparatus for plasma cleaning of chip-mounted board

Plasma treating apparatus, plasma treating method and method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Plasma processing method

Apparatus and method for inspecting soldering condition of electronic component by using ultrasonic oscillation

PANASONIC CORP

Method of manufacturing semiconductor chip using laser light and plasma dicing

Method for fabricating semiconductor chip

TEG removing method in manufacturing method for semiconductor chips

Manufacturing method for semiconductor devices, and formation apparatus for semiconductor wafer dicing masks

Method for dividing semiconductor wafer and manufacturing method for semiconductor devices

Manufacturing method of semiconductor devices

Method of manufacturing semicondictor chip

Manufacturing method for semiconductor chips

Plasma dicing apparatus and method of manufacturing semiconductor chips

Manufacturing method for semiconductor devices, arrangement determination method and apparatus for semiconductor device formation regions, and program for determining arrangement of semiconductor device formation regions

Manufacturing method for semiconductor chips, and semiconductor chip

Plasma processing apparatus

Manufacturing method for semiconductor chips, and semiconductor chip

Method for manufacturing semiconductor chip and method for processing semiconductor wafer

Manufacturing method for semiconductor chips

Manufacturing method for semiconductor chips and semiconductor wafer

ARITA KIYOSHI

Substrate processing method, semiconductor chip manufacturing method, and resin-adhesive-layer-backed semiconductor chip manufacturing method

Gas shower plate for plasma processing apparatus

Method of segmenting semiconductor wafer

Substrate processing method, semiconductor chip manufacturing method, and resin-adhesive-layer-backed semiconductor chip manufacturing method

MIZUKAMI TATSUHIRO

Plasma processing device and method of monitoring plasma discharge state in plasma processing device

Plasma processing device and plasma discharge state monitoring device

Plasma processing device

NONOMURA MASARU

Plasma processing apparatus

Plasma processing apparatus

PANASONIC IP MAN CO LTD

Element chip manufacturing method

DISCO CORP

Semiconductor wafer turning process

HAJI HIROSHI

Method for processing a substrate, method for manufacturing a semiconductor chip, and method for manufacturing a semiconductor chip having a resin adhesive layer

KROSAKI HARIMA CORP

Electrode member used in a plasma treating apparatus