Inventor

HAJI HIROSHI

JP54 patents

⚠️ This page may combine multiple inventors who share the name “HAJI HIROSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HAJI HIROSHI

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Semiconductor device and method of manufacturing the same

Apparatus and method for mounting electronic parts

Method for surface treatment of silicon based substrate

Component mounting method

Electronic component mounting apparatus and electronic component mounting method

Method of manufacturing an electronic component

Plasma processing apparatus and method

Semiconductor device with reinforcing resin layer

Plasma treatment apparatus and method

Method for forming a gold plating electrode a substrate based on the electrode forming method, and a wire bonding method utilizing this electrode forming method

Apparatus and method for plasma etching

Apparatus and method for surface treatment, and apparatus and method for wire bonding using the surface treatment apparatus

Plasma cleaning device for substrate

Apparatus and method for surface treatment, and apparatus and method for wire bonding using the surface treatment apparatus

Wire bonding method

Electric component placement machine

Electric discharge apparatus for cleaning electrode on workpiece and method thereof

Method for forming a gold plating electrode, a substrate based on the electrode forming method, and a wire bonding method utilizing this electrode forming method

Method of forming inner lead bonding on a microchip

Electronic component mounting apparatus and electronic component mounting method

Electronic component mounting apparatus

Resin mold electric part and producing method therefor

Plasma process apparatus and plasma process method for substrate

Method of producing a semiconductor device

Wire bonding apparatus and wire bonding method

Inner lead bonding apparatus

Electric component placement machine

Bump forming method and its forming apparatus.

Electronic component mounting apparatus and method of mounting electronic components

Electronic component mounting method

Electronic component mounting apparatus and electronic component mounting method

Method for mounting electronic parts onto a board

Plasma treating apparatus, plasma treating method and method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Vacuum processing apparatus with improved maintainability

Method for mounting an electronic part by solder position detection

Method for mounting electronic parts on a board

PANASONIC CORP

Method for fabricating semiconductor chip

Manufacturing method for semiconductor devices, and formation apparatus for semiconductor wafer dicing masks

Method for dividing semiconductor wafer and manufacturing method for semiconductor devices

Component mounting apparatus

Manufacturing method for semiconductor devices, arrangement determination method and apparatus for semiconductor device formation regions, and program for determining arrangement of semiconductor device formation regions

Plant cultivation system

Method for manufacturing semiconductor chip and method for processing semiconductor wafer

HAJI HIROSHI

Component bonding method, component laminating method and bonded component structure

Chip pickup apparatus, chip pickup method, chip releasing device and chip releasing method

Method for processing a substrate, method for manufacturing a semiconductor chip, and method for manufacturing a semiconductor chip having a resin adhesive layer

NONOMURA MASARU

Plasma processing apparatus

Plasma processing apparatus

DISCO CORP

Semiconductor wafer turning process