P

Inventor

FENG LEI

CN119 patents
⚠️ This page may combine multiple inventors who share the name “FENG LEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ZHUHAI ACCESS SEMICONDUCTOR CO LTD

19 patents
US12302508B2May 13, 2025

Temporary carrier and method for manufacturing coreless substrate thereby

ZHUHAI ACCESS SEMICONDUCTOR CO LTD2 citations72
US11114310B1Sep 7, 2021

Embedded packaging method capable of realizing heat dissipation

ZHUHAI ACCESS SEMICONDUCTOR CO LTD4 citations70
US12040272B2Jul 16, 2024

Connector for implementing multi-faceted interconnection

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations62
US11984414B2May 14, 2024

Packaging structure with antenna and manufacturing method thereof

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations62
US11769733B2Sep 26, 2023

Package substrate

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations62
US11682621B2Jun 20, 2023

Connector for implementing multi-faceted interconnection

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations62
US11515258B2Nov 29, 2022

Package substrate and manufacturing method thereof

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations62
US11503712B2Nov 15, 2022

Passive device packaging structure embedded in glass medium and method for manufacturing the same

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations62
US12148676B2Nov 19, 2024

Embedded chip package and manufacturing method thereof

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations61
US12040526B2Jul 16, 2024

Method for manufacturing embedded package structure having air resonant cavity

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations61
US11854920B2Dec 26, 2023

Embedded chip package and manufacturing method thereof

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations61
US11257713B2Feb 22, 2022

Interposer board without feature layer structure and method for manufacturing the same

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations61
US11822121B2Nov 21, 2023

Cavity substrate having directional optoelectronic transmission channel and manufacturing method thereof

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations60
US11579362B2Feb 14, 2023

Cavity substrate having directional optoelectronic transmission channel and manufacturing method thereof

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations60
US11450619B2Sep 20, 2022

Embedded packaging structure having shielding cavity and manufacturing method thereof

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations60
US11399440B2Jul 26, 2022

Method for manufacturing coreless substrate

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations60
US12412843B2Sep 9, 2025

Support frame structure and manufacturing method thereof

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations58
US12002734B2Jun 4, 2024

Circuit prearranged heat dissipation embedded packaging structure and manufacturing method thereof

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations58
US11569177B2Jan 31, 2023

Support frame structure and manufacturing method thereof

ZHUHAI ACCESS SEMICONDUCTOR CO LTD0 citations58

FENG LEI

5 patents

EMC CORP

3 patents

HONOR DEVICE CO LTD

2 patents

DU YONGGANG

2 patents

SHANGHAI MAGIC WHEELS SPORTING GOODS CO LTD

2 patents

SIGNIFY HOLDING BV

2 patents

CHENGDU BOE OPTOELECT TECH CO

2 patents

SHAO XIAOLING

1 patent

ZHUHAI LCOLA TECH CO LTD

1 patent

SUN XIAOLU

1 patent

UNIV COLUMBIA

1 patent

INTEL IP CORP

1 patent

ZTE CORP

1 patent

PHILIPS LIGHTING HOLDING BV

1 patent

SUNBEAM PRODUCTS INC

1 patent

TENCENT TECH SHENZHEN CO LTD

1 patent

CHANGZHOU GLOBE CO LTD

1 patent

FAN XIAODONG

1 patent

BEIJING BAIDU NETCOM SCI & TECH CO LTD

1 patent

BOE TECHNOLOGY GROUP CO LTD

1 patent

Showing the top 50 of 119 patents by PatentIndex Score.