Inventor
HOTTA YUJI
JP57 patents
⚠️ This page may combine multiple inventors who share the name “HOTTA YUJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NITTO DENKO CORP
33 patentsUS6144108ANov 7, 2000
Semiconductor device and method of fabricating the same
NITTO DENKO CORP55 citations95
US5846477ADec 8, 1998
Production method for encapsulating a semiconductor device
NITTO DENKO CORP78 citations94
US6245175B1Jun 12, 2001
Anisotropic conductive film and production method thereof
NITTO DENKO CORP52 citations93
US5821628AOct 13, 1998
Semiconductor device and two-layer lead frame for it
NITTO DENKO CORP26 citations93
US6890617B1May 10, 2005
Porous adhesive sheet, semiconductor wafer with porous adhesive sheet, and method of manufacture thereof
NITTO DENKO CORP16 citations92
US6652688B2Nov 25, 2003
Process for producing semiconductor wafer with adhesive film
NITTO DENKO CORP21 citations92
US6492484B2Dec 10, 2002
Polycarbodiimide
NITTO DENKO CORP25 citations92
US6394821B1May 28, 2002
Anisotropic conductive film and production method thereof
NITTO DENKO CORP34 citations92
US6023096AFeb 8, 2000
Semiconductor device having metal foil integral with sealing resin
NITTO DENKO CORP22 citations92
US5834850ANov 10, 1998
Encapsulated semiconductor device having metal foil covering, and metal foil
NITTO DENKO CORP26 citations90
US7722965B2May 25, 2010
Electroluminescence device, planar light source and display using the same
NITTO DENKO CORP16 citations84
US6669869B2Dec 30, 2003
Anisotropic conductive film
NITTO DENKO CORP17 citations84
US6613608B1Sep 2, 2003
Semiconductor wafer with anisotropic conductor film, and method of manufacture thereof
NITTO DENKO CORP13 citations84
US7559681B2Jul 14, 2009
Light pipe for direct-type backlight and direct-type backlight
NITTO DENKO CORP9 citations83
US6978079B2Dec 20, 2005
Optical semiconductor device
NITTO DENKO CORP13 citations83
US6961185B2Nov 1, 2005
Microlens array
NITTO DENKO CORP13 citations83
US7189591B2Mar 13, 2007
Process for producing light-emitting semiconductor device
NITTO DENKO CORP17 citations81
US7290902B2Nov 6, 2007
Direct-type backlight
NITTO DENKO CORP13 citations80
US5904505AMay 18, 1999
Process for producing encapsulated semiconductor device having metal foil material covering and metal foil
NITTO DENKO CORP16 citations80
US6667542B2Dec 23, 2003
Anisotropic conductive film-containing device
NITTO DENKO CORP10 citations74
US6597192B2Jul 22, 2003
Test method of semiconductor device
NITTO DENKO CORP9 citations74
US6114013ASep 5, 2000
Sealing label for sealing semiconductor element
NITTO DENKO CORP8 citations74
US6068932AMay 30, 2000
Thermosetting resin composition
NITTO DENKO CORP8 citations74
US5830949ANov 3, 1998
Adhesive resin composition and adhesive sheet
NITTO DENKO CORP6 citations74
US5562993AOct 8, 1996
Semiconductor device with identification information
NITTO DENKO CORP13 citations74
US5521034AMay 28, 1996
Individual identification label
NITTO DENKO CORP9 citations74
US6566608B2May 20, 2003
Production method of anisotropic conductive film and anisotropic conductive film produced by this method
NITTO DENKO CORP9 citations73
US6538309B1Mar 25, 2003
Semiconductor device and circuit board for mounting semiconductor element
NITTO DENKO CORP11 citations73
US6846550B2Jan 25, 2005
Adhesive film for underfill and semiconductor device using the same
NITTO DENKO CORP7 citations72
US7056406B2Jun 6, 2006
Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture thereof
NITTO DENKO CORP2 citations63
US7231706B2Jun 19, 2007
Method of manufacturing an anisotropic conductive film
NITTO DENKO CORP2 citations62
US6709606B2Mar 23, 2004
Anisotropic conductive film and production method thereof
NITTO DENKO CORP3 citations62
US7221007B2May 22, 2007
Sheet for optical-semiconductor element encapsulation and process for producing optical semiconductor device using the sheet
NITTO DENKO CORP3 citations60
KONISHIROKU PHOTO IND
7 patentsUS4409323AOct 11, 1983
Silver halide photographic material
KONISHIROKU PHOTO IND93 citations96
US4643917AFeb 17, 1987
Heat-sensitive transfer recording medium
KONISHIROKU PHOTO IND37 citations93
US4572860AFeb 25, 1986
Thermal transfer recording medium
KONISHIROKU PHOTO IND27 citations93
US4623580ANov 18, 1986
Thermal transfer recording medium
KONISHIROKU PHOTO IND22 citations82
US4617224AOct 14, 1986
Thermal transfer recording medium
KONISHIROKU PHOTO IND16 citations74
US4840886AJun 20, 1989
Silver halide color photographic material containing a 1h-pyrazole (3,2-C)-s-triazole derived magenta coupler
KONISHIROKU PHOTO IND7 citations72
US4764457AAug 16, 1988
Silver halide photographic emulsion
KONISHIROKU PHOTO IND3 citations63
TOYODA GOSEI KK
3 patentsUS11761106B2Sep 19, 2023
Method for producing black plated resin part
TOYODA GOSEI KK0 citations56
US11198944B2Dec 14, 2021
Black plated resin part and method for producing the same
TOYODA GOSEI KK0 citations56
US10081312B2Sep 25, 2018
Black plated resin part and method for manufacturing the same
TOYODA GOSEI KK0 citations52
SANTEC CORP
2 patentsHOTTA YUJI
2 patentsNATIONAL UNIV CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM
1 patentAIST
1 patentKUWAYAMA TOMOYA
1 patentShowing the top 50 of 57 patents by PatentIndex Score.