Inventor
CHANG EDWARD YI
TW32 patents
⚠️ This page may combine multiple inventors who share the name “CHANG EDWARD YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NATIONAL YANG MING CHIAO TUNG UNIV
11 patentsUS11646732B1May 9, 2023
Power module
NATIONAL YANG MING CHIAO TUNG UNIV2 citations68
US11387824B1Jul 12, 2022
Voltage-controlled varied frequency pulse width modulator
NATIONAL YANG MING CHIAO TUNG UNIV1 citations58
US12426344B2Sep 23, 2025
Method of manufacturing semiconductor device
NATIONAL YANG MING CHIAO TUNG UNIV0 citations55
US11670699B2Jun 6, 2023
Semiconductor device and method of manufacturing the same
NATIONAL YANG MING CHIAO TUNG UNIV0 citations55
US12369375B2Jul 22, 2025
Gallium nitride transistor
NATIONAL YANG MING CHIAO TUNG UNIV0 citations54
US12557315B2Feb 17, 2026
Semiconductor device and manufacturing method thereof
NATIONAL YANG MING CHIAO TUNG UNIV0 citations52
US12495569B2Dec 9, 2025
High electron mobility transistor
NATIONAL YANG MING CHIAO TUNG UNIV0 citations52
US12347678B2Jul 1, 2025
MOCVD method for growing INALGAN/GAN heterostructure
NATIONAL YANG MING CHIAO TUNG UNIV0 citations51
US12155256B2Nov 26, 2024
Fast charging driver
NATIONAL YANG MING CHIAO TUNG UNIV0 citations50
US12088114B2Sep 10, 2024
Inductive resonant wireless charging system, resonant wireless charging transmitting device, wireless charging relay device and inductive wireless charging receiving device
NATIONAL YANG MING CHIAO TUNG UNIV0 citations48
US11569696B2Jan 31, 2023
Control method of a minimum power input
NATIONAL YANG MING CHIAO TUNG UNIV0 citations46
UNIV NAT CHIAO TUNG
8 patentsUS7940143B2May 10, 2011
Vertical transmission line structure that includes bump elements for flip-chip mounting
UNIV NAT CHIAO TUNG7 citations83
US7829448B1Nov 9, 2010
Structure of high electron mobility transistor, a device comprising the structure and a method of producing the same
UNIV NAT CHIAO TUNG8 citations83
US7420227B2Sep 2, 2008
Cu-metalized compound semiconductor device
UNIV NAT CHIAO TUNG17 citations83
US7847410B2Dec 7, 2010
Interconnect of group III-V semiconductor device and fabrication method for making the same
UNIV NAT CHIAO TUNG9 citations78
US7368822B2May 6, 2008
Copper metalized ohmic contact electrode of compound device
UNIV NAT CHIAO TUNG12 citations78
US8034654B2Oct 11, 2011
Method for forming a GexSi1-x buffer layer of solar-energy battery on a silicon wafer
UNIV NAT CHIAO TUNG2 citations53
US8519488B2Aug 27, 2013
III-V metal-oxide-semiconductor device
UNIV NAT CHIAO TUNG0 citations51
US8033039B2Oct 11, 2011
High frequency flip chip package process of polymer substrate and structure thereof
UNIV NAT CHIAO TUNG0 citations48
CHANG EDWARD YI
5 patentsUS8169002B2May 1, 2012
High electron mobility transistor and method for fabricating the same
CHANG EDWARD YI100 citations95
US8169276B2May 1, 2012
Vertical transmission line structure that includes bump elements for flip-chip mounting
CHANG EDWARD YI4 citations61
US8536616B2Sep 17, 2013
Multilayer substrate having gallium nitride layer and method for forming the same
CHANG EDWARD YI3 citations57
US8263425B2Sep 11, 2012
Multilayer substrate having gallium nitride layer and method for forming the same
CHANG EDWARD YI2 citations57
US8435875B1May 7, 2013
Method for forming T-shaped gate structure
CHANG EDWARD YI1 citations46
UNIV NATIONAL CHIAO TUNG
3 patentsUS11271109B2Mar 8, 2022
Silicon metal-oxide-semiconductor field effect transistor (Si MOSFET) with a wide-bandgap III-V compound semiconductor group drain and method for fabricating the same
UNIV NATIONAL CHIAO TUNG1 citations56
US11322398B2May 3, 2022
Process for making interconnect of group III-V semiconductor device, and group III-V semiconductor device including interconnect made thereby
UNIV NATIONAL CHIAO TUNG0 citations49
US11342179B2May 24, 2022
Semiconductor structure having a Si substrate heterointegrated with GaN and method for fabricating the same
UNIV NATIONAL CHIAO TUNG0 citations43