Inventor
SUGINO TAKASI
JP2 patents
Patents
2 patentsUS5705016AJan 6, 1998
Method of preventing transfer of adhesive substance to dicing ring frame, pressure-sensitive adhesive sheet for use in the method and wafer working sheet having the pressure-sensitive adhesive sheet
LINTEC CORP98 citations95
US5888606AMar 30, 1999
Method of preventing transfer of adhesive substance to dicing ring frame, pressure-sensitive adhesive sheet for use in the method and wafer working sheet having the pressure-sensitive adhesive sheet
LINTEC CORP49 citations93